MM74HCT34J datasheet, PDF - EEWORLD Datasheet

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MM74HCT34J: DescriptionHCT SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, DIP-14; Categorylogic logic; File Size106KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MM74HCT34J Overview

HCT SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, DIP-14

MM74HCT34J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
series	HCT
JESD-30 code	R-GDIP-T14
JESD-609 code	e0
length	19.43 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Number of functions	6
Number of entries	1
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Prop。Delay @ Nom-Sup	29 ns
propagation delay (tpd)	29 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

MM74HCT34J Related Products

	MM74HCT34J	MM74HCT34N	MM54HCT34J
Description	HCT SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, DIP-14	HCT SERIES, HEX 1-INPUT NON-INVERT GATE, PDIP14, DIP-14	HCT SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, DIP-14
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknow
series	HCT	HCT	HCT
JESD-30 code	R-GDIP-T14	R-PDIP-T14	R-GDIP-T14
JESD-609 code	e0	e0	e0
length	19.43 mm	19.18 mm	19.43 mm
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER
Number of functions	6	6	6
Number of entries	1	1	1
Number of terminals	14	14	14
Maximum operating temperature	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
propagation delay (tpd)	29 ns	29 ns	33 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
Maximum seat height	5.08 mm	5.08 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm
MaximumI(ol)	0.004 A	0.004 A	-
Prop。Delay @ Nom-Sup	29 ns	29 ns	-

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