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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PCI7510GHK
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PCI7510GHK

Description
PCMCIA BUS CONTROLLER, PBGA209, MICROSTAR, PLASTIC, BGA-209
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB，241 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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PCI7510GHK Overview

PCMCIA BUS CONTROLLER, PBGA209, MICROSTAR, PLASTIC, BGA-209

PCI7510GHK Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeBGA
package instructionMICROSTAR, PLASTIC, BGA-209
Contacts209
Reach Compliance Codeunknown
Address bus width32
Bus compatibilityPCI
maximum clock frequency24.576 MHz
Maximum data transfer rate132 MBps
External data bus width32
JESD-30 codeS-PBGA-B209
JESD-609 codee0
length16 mm
Humidity sensitivity level3
Number of terminals209
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)220
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width16 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCMCIA

PCI7510GHK Preview

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PCI7510
PC Card, Smart Card and Integrated
1394a 2000 OHCI Two Port PHY/Link Layer
Controller
Data Manual
September 2004
Connectivity Solutions
SCPS073A
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
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Post Office Box 655303 Dallas, Texas 75265
Copyright
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Contents
Section
1
Title
Page
1−1
1−1
1−2
1−3
1−4
1−5
1−5
2−1
3−1
3−1
3−2
3−2
3−2
3−2
3−3
3−3
3−3
3−3
3−4
3−5
3−5
3−5
3−6
3−6
3−6
3−6
3−7
3−8
3−10
3−10
3−10
3−11
3−11
3−12
3−12
3−13
3−13
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5
Terms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Feature/Protocol Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Power Supply Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Smart Card Dedicated Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1
Smart Card Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2
Dedicated Socket (Function 1) Interface . . . . . . . . . . . . . . .
3.3
I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Clamping Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5
Peripheral Component Interconnect (PCI) Interface . . . . . . . . . . . . . .
3.5.1
1394 PCI Bus Master . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.2
PCI Bus Lock (LOCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.3
Serial EEPROM I
2
C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.4
Loading CardBus (Function 0) Subsystem Identification . .
3.5.4.1
Function 2 Subsystem Identification . . . . . . . .
3.5.4.2
Function 3 Subsystem Identification . . . . . . . .
3.6
PC Card Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1
PC Card Insertion/Removal and Recognition . . . . . . . . . . .
3.6.2
Low Voltage CardBus Card Detection . . . . . . . . . . . . . . . . .
3.6.3
Card Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.4
Power Switch Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.5
Zoomed Video Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.6
Standardized Zoomed-Video Register Model . . . . . . . . . . .
3.6.7
Internal Ring Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.8
Integrated Pullup Resistors for PC Card Interface . . . . . . .
3.6.9
SPKROUT and CAUDPWM Usage . . . . . . . . . . . . . . . . . . .
3.6.10
LED Socket Activity Indicators . . . . . . . . . . . . . . . . . . . . . . . .
3.6.11
CardBus Socket Registers . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.12
PCI Firmware Loading Function Programming Model . . . .
3.6.12.1
Data/Address Register . . . . . . . . . . . . . . . . . . .
3.6.12.2
Firmware Loader Control Register . . . . . . . . .
2
3
iii
4
Serial EEPROM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.1
Serial-Bus Interface Implementation . . . . . . . . . . . . . . . . . . .
3.7.2
Accessing Serial-Bus Devices Through Software . . . . . . .
3.7.3
Serial-Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.4
Serial-Bus EEPROM Application . . . . . . . . . . . . . . . . . . . . . .
3.8
Programmable Interrupt Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
PC Card Functional and Card Status Change Interrupts .
3.8.2
Interrupt Masks and Flags . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.3
Using Parallel IRQ Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.4
Using Parallel PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.5
Using Serialized IRQSER Interrupts . . . . . . . . . . . . . . . . . . .
3.8.6
SMI Support in the PCI7510 Device . . . . . . . . . . . . . . . . . . .
3.9
Power Management Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.1
1394 Power Management (Function 2) . . . . . . . . . . . . . . . .
3.9.2
Integrated Low-Dropout Voltage Regulator (LDO-VR) . . . .
3.9.3
CardBus (Function 0) Clock Run Protocol . . . . . . . . . . . . . .
3.9.4
CardBus PC Card Power Management . . . . . . . . . . . . . . . .
3.9.5
16-Bit PC Card Power Management . . . . . . . . . . . . . . . . . . .
3.9.6
Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.7
Requirements for Suspend Mode . . . . . . . . . . . . . . . . . . . . .
3.9.8
Ring Indicate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.9
PCI Power Management for CardBus (Function 0) . . . . . .
3.9.9.1
Function 2 Power Management . . . . . . . . . . . .
3.9.9.2
Function 3 Power Management . . . . . . . . . . . .
3.9.10
CardBus Bridge Power Management . . . . . . . . . . . . . . . . . .
3.9.11
ACPI Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.12
Master List of PME Context Bits and Global Reset-Only
Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10 IEEE 1394 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.1
PHY Port Cable Connection . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.2
Crystal Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.3
Bus Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PC Card Controller Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
PCI Configuration Registers (Functions 0 and 1) . . . . . . . . . . . . . . . . .
4.2
Vendor ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Device ID Register Function 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4
Device ID Register Function 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5
Command Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.7
Revision ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.8
Class Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.9
Cache Line Size Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.10 Latency Timer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.11 Header Type Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7
3−14
3−14
3−14
3−14
3−16
3−19
3−19
3−20
3−21
3−21
3−22
3−22
3−22
3−23
3−23
3−24
3−24
3−24
3−24
3−25
3−25
3−26
3−27
3−27
3−27
3−28
3−28
3−30
3−30
3−31
3−32
4−1
4−1
4−2
4−3
4−3
4−4
4−5
4−6
4−6
4−6
4−7
4−7
iv
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PCI7510GHK Related Products

PCI7510GHK PCI7510PDV
Description PCMCIA BUS CONTROLLER, PBGA209, MICROSTAR, PLASTIC, BGA-209 PCMCIA BUS CONTROLLER, PQFP208, PLASTIC, MO-136, QFP-208
Is it lead-free? Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics
Parts packaging code BGA QFP
package instruction MICROSTAR, PLASTIC, BGA-209 PLASTIC, MO-136, QFP-208
Contacts 209 208
Reach Compliance Code unknown unknown
Address bus width 32 32
Bus compatibility PCI PCI
maximum clock frequency 24.576 MHz 24.576 MHz
Maximum data transfer rate 132 MBps 132 MBps
External data bus width 32 32
JESD-30 code S-PBGA-B209 S-PQFP-G208
JESD-609 code e0 e4
length 16 mm 28 mm
Humidity sensitivity level 3 1
Number of terminals 209 208
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFQFP
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 220 260
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.6 mm
Maximum supply voltage 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD NICKEL PALLADIUM GOLD
Terminal form BALL GULL WING
Terminal pitch 0.8 mm 0.5 mm
Terminal location BOTTOM QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 16 mm 28 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA

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