8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP56, SDIP-56
| Parameter Name | Attribute value |
| Maker | Motorola ( NXP ) |
| Parts packaging code | DIP |
| package instruction | SDIP, |
| Contacts | 56 |
| Reach Compliance Code | unknown |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 4.2 MHz |
| DAC channel | YES |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDIP-T56 |
| length | 52.07 mm |
| Number of I/O lines | 24 |
| Number of terminals | 56 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 5.08 mm |
| speed | 2.1 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | HCMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC68HC05T10B | MC68HC05T7B | MC68HC705T10B | |
|---|---|---|---|
| Description | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP56, SDIP-56 | Microcontroller, 8-Bit, MROM, 2.1MHz, HCMOS, PDIP56, SDIP-56 | 8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP56, SDIP-56 |
| package instruction | SDIP, | SDIP, | SDIP, |
| Reach Compliance Code | unknown | unknown | unknow |
| Has ADC | YES | YES | YES |
| bit size | 8 | 8 | 8 |
| maximum clock frequency | 4.2 MHz | 4.2 MHz | 4.2 MHz |
| DAC channel | YES | YES | YES |
| DMA channel | NO | NO | NO |
| JESD-30 code | R-PDIP-T56 | R-PDIP-T56 | R-PDIP-T56 |
| length | 52.07 mm | 52.07 mm | 52.07 mm |
| Number of I/O lines | 24 | 24 | 24 |
| Number of terminals | 56 | 56 | 56 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP | SDIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| ROM programmability | MROM | MROM | OTPROM |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| speed | 2.1 MHz | 2.1 MHz | 2.1 MHz |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | HCMOS | HCMOS | HCMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.778 mm | 1.778 mm | 1.778 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) |
| Parts packaging code | DIP | - | DIP |
| Contacts | 56 | - | 56 |