Telephone Dialer Circuit, CMOS, PDIP22, DIP-22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ROHM Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.3 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T22 |
| JESD-609 code | e0 |
| length | 26.3 mm |
| damage rate | 1:2 |
| Number of functions | 1 |
| Number of terminals | 22 |
| Maximum operating temperature | 60 °C |
| Minimum operating temperature | -10 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2.5 V |
| Certification status | Not Qualified |
| reserve | REPERTORY |
| Maximum seat height | 4.45 mm |
| Maximum slew rate | 0.002 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |





| BU8329 | BU8329F | |
|---|---|---|
| Description | Telephone Dialer Circuit, CMOS, PDIP22, DIP-22 | Telephone Dialer Circuit, CMOS, PDSO24, SOP-24 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | ROHM Semiconductor | ROHM Semiconductor |
| Parts packaging code | DIP | SOIC |
| package instruction | DIP, DIP22,.3 | SOP, SOP24,.3 |
| Contacts | 22 | 24 |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T22 | R-PDSO-G24 |
| JESD-609 code | e0 | e0 |
| length | 26.3 mm | 15 mm |
| damage rate | 1:2 | 1:2 |
| Number of functions | 1 | 1 |
| Number of terminals | 22 | 24 |
| Maximum operating temperature | 60 °C | 60 °C |
| Minimum operating temperature | -10 °C | -10 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Encapsulate equivalent code | DIP22,.3 | SOP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2.5 V | 2.5 V |
| Certification status | Not Qualified | Not Qualified |
| reserve | REPERTORY | REPERTORY |
| Maximum seat height | 4.45 mm | 1.9 mm |
| Maximum slew rate | 0.002 mA | 0.002 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 5.4 mm |