M24C16-FBN5G datasheet, PDF - EEWORLD Datasheet

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M24C16-FBN5G: Description2KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8; Categorystorage storage; File Size679KB，38 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M24C16-FBN5G Overview

2KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8

M24C16-FBN5G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010MMMR
JESD-30 code	R-PDIP-T8
length	9.27 mm
memory density	16384 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/5 V
Certification status	Not Qualified
Maximum seat height	5.33 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.0008 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE

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M24C16-W M24C16-R

M24C16-F

16-Kbit serial I²C bus EEPROM

Datasheet

production data

Features

•

Compatible with all I

C bus modes:

– 400 kHz

– 100 kHz

•

Memory array:

– 16 Kbit (2 Kbytes) of EEPROM

– Page size: 16 bytes

•

Single supply voltage:

– M24C16-W: 2.5 V to 5.5 V

– M24C16-R: 1.8 V to 5.5 V

– M24C16-F: 1.7 V to 5.5 V (full temperature

range) and 1.6 V to1.7 V (limited

temperature range)

•

Write:

– Byte Write within 5 ms

– Page Write within 5 ms

•

Operating temperature range: from -40 °C up

to +85 °C

•

Random and sequential Read modes

•

Write protect of the whole memory array

UFDFPN8

(MB, MC)

•

Enhanced ESD/Latch-Up protection

•

More than 4 million Write cycles

•

More than 200-year data retention

•

Packages:

– RoHS compliant and halogen-free

(ECOPACK

)

UFDFPN5

(MH)

TSSOP8 (DW)

169 mil width

SO8 (MN)

150 mil width

PDIP8 (BN)

WLCSP (CS)

October 2013

This is information on a product in full production.

DocID023494 Rev 4

1/38

www.st.com

Contents

M24C16-W M24C16-R M24C16-F

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

(ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.5.1

2.5.2

2.5.3

2.5.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

4.2

4.3

4.4

4.5

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1.1

5.1.2

5.1.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.2.1

5.2.2

5.2.3

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2/38

DocID023494 Rev 4

List of tables

M24C16-W M24C16-R M24C16-F

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range F, for devices identified by process letter T) . . . . . . . 21

Operating conditions (voltage range F, for all other devices) . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC characteristics (M24C16-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24C16-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24C16-F device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

100 kHz AC characteristics (I

C Standard mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 29

SO8N – 8-lead plastic small outline, 150 mils body width, package data. . . . . . . . . . . . . . 30

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 31

UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine

pitch Dual Flat Package, No lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

M24C16-FCS5TP/S WLCSP 5 bumps package data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4/38

DocID023494 Rev 4

M24C16-W M24C16-R M24C16-F

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

UFDFPN5 package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

M24C16-FCS5TP/S WLCSP connections (top view, marking side, with balls on the

underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Maximum R

bus

value versus bus parasitic capacitance (C

bus

) for

an I

C bus at maximum frequency f

= 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 29

SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 30

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 31

UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch . . . . . . . . . . . . . . . . . .

Dual Flat Package, No lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch . . . . . . . . . . . . . . . . . .

Dual Flat Package, No lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

M24C16-FCS5TP/S WLCSP 5 bumps package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

DocID023494 Rev 4

5/38

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