Detail contact area
8,03
4,34
38,66
1,78
14,75
11,66
15,24
Mittellinie Leiterplatte
Centerline of daughter card
A
PIN 1
C
37
Offset von Führungssteg zu Referenzzapfen
0,15
10
Offset from guiding bar to reference peg
NOTES :
Datum
Date code (see notes )
Material: LCP GF 30 schwarz
Material: LCP GF 30 black
Galvanik: min. 1,27 µm Unternickelung
über den gesamten PIN - Bereich
min. 0,127 µm Au im Steckbereich
Gold - Flash im Lötbereich
XXXX_XX ERNI RC X
Plating: min. 1,27 µm Ni entire contact
min. 0,127 µm Au in contact area
Gold - Flash plating on contact tails
1.) Fertiglochdurchmesser
finished viadiameter (PTH)
Package: Tray ( 20 pcs. )
56,5
Lochbild für Leiterplatte ( Bestückungsseite)
Board hole pattern ( component mounting side)
37
0,7
±0,08
1.)
3
B49
B12
10
1
B2
B1
daughter card layout
39,15
12,14
10
0,71
1,4
M 1:1
1,57 across pads
20,3
Maß "A"
8,41
16,69
Maß "B"
2,54
Maß "C"
5,59
2
15,24
2,5
Dim "A"
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Dim "B"
4
B
Dim "C"
A49
A12
2,35 (2x)
A1
A2
1,35
40,15
56,5
14,9
Information:
Tolerances
All Dimensions
in mm
Scale
5:1
2
3,12
4,48
37 x 1 = 37
1,49
1,91
±0,05
Layout proposal is in accordance with the PCI Express spezification
2 0°
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
f
Index
04.11.2011
Date
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Abgew. PCI Express STV 98pol.
RT. Angle PCI Express 98 pins
www.ERNI.com
Class
100101610001
PCIEXP
I
A2
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