SRAM Module, 512KX32, 25ns, CMOS, PQCC68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Syntaq Technology Inc |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| memory density | 16777216 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of terminals | 68 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX32 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.04 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.76 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |





| PUMA68S16000X-25 | PUMA68S16000X-15 | PUMA68S16000X-20 | PUMA68S16000XI-45 | |
|---|---|---|---|---|
| Description | SRAM Module, 512KX32, 25ns, CMOS, PQCC68 | SRAM Module, 512KX32, 15ns, CMOS, PQCC68 | SRAM Module, 512KX32, 20ns, CMOS, PQCC68 | SRAM Module, 512KX32, 45ns, CMOS, PQCC68 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 25 ns | 15 ns | 20 ns | 45 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 | 32 |
| Number of terminals | 68 | 68 | 68 | 68 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C |
| organize | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.76 mA | 0.76 mA | 0.76 mA | 0.76 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Objectid | - | 101278426 | 101278432 | 101278457 |
| ECCN code | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |