SRAM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | APTA Group Inc |
| package instruction | , |
| Reach Compliance Code | unknown |
| JESD-609 code | e0 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| PUMA68S16000XI-20 | PUMA68S16000X-25 | PUMA68S16000XI-15 | PUMA68S16000X-15 | PUMA68S16000X-20 | |
|---|---|---|---|---|---|
| Description | SRAM | SRAM Module, 512KX32, 25ns, CMOS, PQCC68 | SRAM Module, 512KX32, 15ns, CMOS, PQCC68 | SRAM Module, 512KX32, 15ns, CMOS, PQCC68 | SRAM Module, 512KX32, 20ns, CMOS, PQCC68 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | , | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maker | APTA Group Inc | APTA Group Inc | APTA Group Inc | - | - |
| Maximum access time | - | 25 ns | 15 ns | 15 ns | 20 ns |
| I/O type | - | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | - | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
| memory density | - | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | - | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | - | 32 | 32 | 32 | 32 |
| Number of terminals | - | 68 | 68 | 68 | 68 |
| word count | - | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | - | 512000 | 512000 | 512000 | 512000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 85 °C | 70 °C | 70 °C |
| organize | - | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | - | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | - | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | - | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | - | 5 V | 5 V | 5 V | 5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | - | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
| Minimum standby current | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | - | 0.76 mA | 0.76 mA | 0.76 mA | 0.76 mA |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | - | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | - | QUAD | QUAD | QUAD | QUAD |
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