Audio Synthesizer IC, CMOS, PDIP18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Holtek |
| package instruction | DIP, DIP18(UNSPEC) |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T18 |
| JESD-609 code | e0 |
| Number of terminals | 18 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18(UNSPEC) |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 3 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| HT2887(18DIP-A0) | HT2887(16SOP-A0) | |
|---|---|---|
| Description | Audio Synthesizer IC, CMOS, PDIP18 | Audio Synthesizer IC, CMOS, PDSO16 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Holtek | Holtek |
| package instruction | DIP, DIP18(UNSPEC) | SOP, SO16(UNSPEC) |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T18 | R-PDSO-G16 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 18 | 16 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Encapsulate equivalent code | DIP18(UNSPEC) | SO16(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| power supply | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal location | DUAL | DUAL |
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