514-93-223-18-098034 datasheet, PDF

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514-93-223-18-098034: DescriptionIC Socket, PGA223, 223 Contact(s),; CategoryThe connector socket; File Size157KB，1 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

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514-93-223-18-098034 Overview

IC Socket, PGA223, 223 Contact(s),

514-93-223-18-098034 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mill-Max
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	PGA SOCKET
Contact to complete cooperation	GOLD (30) OVER NICKEL (100)
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact material	NOT SPECIFIED
Device slot type	IC SOCKET
Type of equipment used	PGA223
Shell material	POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
JESD-609 code	e0
Number of contacts	223

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SURFACE MOUNT PIN GRID ARRAYS

For Standard .100” Spacing

Male Pin Header & Female Socket

•

Series 599 SMT PGA headers and Series 514 SMT PGA sockets are

assembled with MM pin# 9976, and receptacle# 1434 respectively.

Each floats vertically within the insulator to compensate for uneven

solder paste on the PCB. Typical example illustrated.

1) “Floating” pin SMT Headers using

machined epoxy insulator.

2) Detail of “Floating” pins which

compensate for unevenly

screened solder paste.

3) PQFP device

4) Translator board

5) Existing motherboard

Series 599, 514

Ordering Information

HEADER TYPE 9976

FOR PGA MALE PIN HEADER

1. Locate footprint pattern from pages 107 to 111, the middle 8 digits of

the part number will be located under the pattern.

Series

Plating

Code

Window

5 9 9

1 0

No. of pins

Grid size

Pattern #

4 7 6

Determined from footprint pattern pages 107 to 111

SPECIFY PLATING CODE XX=

10μ” Au

Pin Plating

SMT RECEPTACLE

TYPE 1434

FOR PGA FEMALE SOCKET

1. Specify 2-digit plating code from chart at bottom of page.

2. Locate footprint pattern from pages 107 to 111, the middle 8 digits of

the part number will be located under the pattern.

Series

Plating

Code

Window

5 1 4

No. of pins

10µ” Au

30µ” Au

Grid size

10µ” Au

Pattern #

30µ” Au

0 3 4

Determined from footprint pattern pages 107 to 111

SPECIFY PLATING CODE XX=

200µ”Sn/Pb

10µ” Au

Sleeve (Pin)

Contact (Clip)

200µ” Sn/Pb

200µ” Sn/Pb 200µ”Sn/Pb

200µ”Sn

200µ”Sn 200µ”Sn

30µ” Au 200µ”Sn

w w w. m i l l - m a x . c o m

102

516-922-6000

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