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514-93-181-17-001034

Description
IC Socket, PGA181, 181 Contact(s),
CategoryThe connector    socket   
File Size157KB,1 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Download Datasheet Parametric View All

514-93-181-17-001034 Overview

IC Socket, PGA181, 181 Contact(s),

514-93-181-17-001034 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMill-Max
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPGA SOCKET
Contact to complete cooperationGOLD (30) OVER NICKEL (100)
Contact completed and terminatedTin/Lead (Sn/Pb)
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedPGA181
Shell materialPOLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
JESD-609 codee0
Number of contacts181
SURFACE MOUNT PIN GRID ARRAYS
For Standard .100” Spacing
Male Pin Header & Female Socket
Series 599 SMT PGA headers and Series 514 SMT PGA sockets are
assembled with MM pin# 9976, and receptacle# 1434 respectively.
Each floats vertically within the insulator to compensate for uneven
solder paste on the PCB. Typical example illustrated.
1) “Floating” pin SMT Headers using
machined epoxy insulator.
2) Detail of “Floating” pins which
compensate for unevenly
screened solder paste.
3) PQFP device
4) Translator board
5) Existing motherboard
Series 599, 514
Ordering Information
HEADER TYPE 9976
FOR PGA MALE PIN HEADER
1. Locate footprint pattern from pages 107 to 111, the middle 8 digits of
the part number will be located under the pattern.
Series
Plating
Code
Window
5 9 9
-
1 0
-
No. of pins
-
Grid size
-
Pattern #
4 7 6
Determined from footprint pattern pages 107 to 111
SPECIFY PLATING CODE XX=
10
10μ” Au
Pin Plating
SMT RECEPTACLE
TYPE 1434
FOR PGA FEMALE SOCKET
1. Specify 2-digit plating code from chart at bottom of page.
2. Locate footprint pattern from pages 107 to 111, the middle 8 digits of
the part number will be located under the pattern.
Series
Plating
Code
Window
5 1 4
-
-
No. of pins
13
10µ” Au
30µ” Au
-
Grid size
91
10µ” Au
-
Pattern #
93
30µ” Au
0 3 4
Determined from footprint pattern pages 107 to 111
SPECIFY PLATING CODE XX=
99
200µ”Sn/Pb
41
10µ” Au
43
44
Sleeve (Pin)
Contact (Clip)
200µ” Sn/Pb
200µ” Sn/Pb 200µ”Sn/Pb
200µ”Sn
200µ”Sn 200µ”Sn
30µ” Au 200µ”Sn
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