AM29DL322DB90WDFN datasheet, PDF

Datasheet> All Categories > storage> storage> AM29DL322DB90WDFN

AM29DL322DB90WDFN: DescriptionFlash, 2MX16, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63; Categorystorage storage; File Size1MB，56 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

Download Datasheet Parametric View All

AM29DL322DB90WDFN Overview

Flash, 2MX16, 90ns, PBGA63, 8 X 14 MM, 0.80 MM PITCH, FBGA-63

AM29DL322DB90WDFN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	63
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
startup block	BOTTOM
JESD-30 code	R-PBGA-B63
JESD-609 code	e1
length	14 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	63
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	8 mm

Preview

Download Datasheet

View All

Am29DL322D/323D/324D

Data Sheet

This product has been retired and is not available for designs. For new and current designs involving TSOP pack-

ages, S29JL032H supersedes Am29DL32xD and is the factory-recommended migration path. Please refer to the

S29JL032H Datasheet for specifications and ordering information.

For new and current designs involving Fine-pitch BGA (FBGA) packages, S29PL032J supersedes Am29DL32xD

and is the factory-recommended migration path. Please refer to the S29PL032J Datasheet for specifications and

ordering information. Availability of this document is retained for reference and historical purposes only.

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

21534

Revision

Amendment

Issue Date

December 13, 2005

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7

Special Handling Instructions for FBGA Package .......................... 8

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Word/Byte Configuration .............................................................. 10

Requirements for Reading Array Data ......................................... 10

Writing Commands/Command Sequences .................................. 11

Simultaneous Read/Write Operations

with Zero Latency .........................................................................11

Standby Mode .............................................................................. 11

Automatic Sleep Mode .................................................................11

RESET#: Hardware Reset Pin .....................................................12

Output Disable Mode ...................................................................12

Autoselect Mode .......................................................................... 17

Sector/Sector Block Protection and Unprotection ........................ 18

Write Protect (WP#) .....................................................................19

Temporary Sector Unprotect ........................................................19

Figure 1. Temporary Sector Unprotect Operation................................. 19

Figure 2. In-System Sector Protection/

Sector Unprotection Algorithms ............................................................ 20

DQ6: Toggle Bit I .......................................................................... 32

Figure 6. Toggle Bit Algorithm .............................................................. 32

DQ2: Toggle Bit II ......................................................................... 33

Reading Toggle Bits DQ6/DQ2 .................................................... 33

DQ5: Exceeded Timing Limits ...................................................... 33

DQ3: Sector Erase Timer ............................................................. 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 35

Figure 7. Maximum Negative Overshoot Waveform............................. 35

Figure 8. Maximum Positive Overshoot Waveform .............................. 35

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 9. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents).................................................................... 37

Figure 10. Typical I

CC1

vs. Frequency................................................... 37

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 11. Test Setup .......................................................................... 38

Figure 12. Input Waveforms and Measurement Levels ........................ 38

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 13. Read Operation Timings...................................................... 39

Figure 14. Reset Timings...................................................................... 40

Word/Byte Configuration (BYTE#) ............................................... 41

Figure 15. BYTE# Timings for Read Operations .................................. 41

Figure 16. BYTE# Timings for Write Operations .................................. 41

Erase and Program Operations ................................................... 42

Figure 17. Program Operation Timings ................................................

Figure 18. Accelerated Program Timing Diagram ................................

Figure 19. Chip/Sector Erase Operation Timings .................................

Figure 20. Back-to-back Read/Write Cycle Timings .............................

Figure 21. Data# Polling Timings (During Embedded Algorithms) .......

Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............

Figure 23. DQ2 vs. DQ6 .......................................................................

SecSi

(Secured Silicon) Sector

Flash Memory Region ..................................................................21

Hardware Data Protection ............................................................22

Common Flash Memory Interface (CFI) . . . . . . . 22

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ......................................................................25

Reset Command ..........................................................................26

Autoselect Command Sequence ..................................................26

Enter SecSi

Sector/Exit SecSi Sector

Command Sequence ...................................................................26

Byte/Word Program Command Sequence ................................... 26

Figure 3. Program Operation ................................................................ 27

Temporary Sector Unprotect ........................................................ 47

Figure 24. Temporary Sector Unprotect Timing Diagram..................... 47

Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 48

Alternate CE# Controlled Erase and Program Operations ........... 49

Figure 26. Alternate CE# Controlled Write (Erase/Program)

Operation Timings ................................................................................ 50

Chip Erase Command Sequence .................................................27

Sector Erase Command Sequence ..............................................28

Erase Suspend/Erase Resume Commands ................................ 28

Figure 4. Erase Operation..................................................................... 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 31

DQ7: Data# Polling ......................................................................31

Figure 5. Data# Polling Algorithm ......................................................... 31

Erase And Programming Performance . . . . . . . 51

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 51

TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 51

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 52

FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 14 mm . 52

TS 048—48-Pin Standard TSOP ................................................. 53

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 54

RY/BY#: Ready/Busy# ................................................................. 32

December 13, 2005

Am29DL322D/323D/324D

Recommended Resources

LM3886 BTL amplifier

1.8 to 35.3V continuously adjustable power supply circuit diagram with overcurrent protection

Simple public telephone meter circuit diagram

Delay pick-up relay with superimposed pulses

UC3842 pulse width modulator internal block diagram

Winding rotor asynchronous motor manual automatic series reactor step-down starting circuit

CC2530 Design Data: I haven't been to the forum for a long time. I uploaded some heavyweight information.This is TI's design data for CC2530. It seems that many people use this material to make boards. The material inclu...; kouyu RF/Wirelessly

PCB learning: I have a junior high school degree and want to learn how to draw PCB. Is it better to learn by myself or to take a training class? I have been working as a hardware assistant in the automotive electro...; MK-yang PCB Design

How to solve these KEIL C51 errors?: If anyone knows, please let me know, because many of my example programs have this problem and I don't know how to solve it. Thank you, kind experts, please help me. This is my first time learning 51 ...; enyinghan 51mcu

Allwinner V853 development board Tina SDK LCD small resolution DCLK setting problem: **1. Topic** Tina SDK LCD small resolution DCLK setting**2. Problem background** Product: Product with display Hardware: V series + DE Software: Tina SDK Others: Using a small-resolution LCD display f...; aleksib Domestic Chip Exchange

cmd file problem: In the past few days, when I was doing the experiment of time domain analysis of speech signals based on DSP5509, the project was compiled successfully without errors, but there were two warnings. The...; panyh DSP and ARM Processors

AD9851 Module Instructions: AD9851 Module Instructions...; zhuizhuzhe ADI Reference Circuit

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components