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The RZ family of high-density, board-to-board or flex circuit
stacking applications is unique, offering users a reliable
one-piece contact system. Its solder-less interconnect is
compressed or “sandwiched” under pressure between parallel
printed wiring boards or between a printed wiring board and
other electronic components such as an IC or multichip module.
•
0.050” staggered grid array
•
Up to 400 contacts per square inch
•
BeCu contacts for reliable mating
•
Standard heights from 0.100” to 0.350”
•
Customer configurations available to meet your
specific design needs.
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(512 ) 863-5585
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DIMENSIONS
VERTICAL COMPRESSION (Z-AXIS),
OPEN-PIN FIELD
A high-density, open-field, vertically-compressed
connector utilizing a patented z-axis contact
system configured for between-board (board-to-
board) compression applications.
Contact spacing: 0.050” (1.27 mm)
CONTACT CUSTOMER SERVICE
ORDER FORM
CONSULT THE AIRBORN WEBSITE FOR THE LATEST REVISION
Sample Part
PRIOR TO BEGINNING ANY DESIGN WORK.
PLEASE
OF THIS DOCUMENT
Number Format: RZ250-320-115-1000
ENTER
CODE
ENTER
CODE
ENTER
CODE
ENTER
CODE
ENTER
CODE
ENTER
CODE
ENTER
CODE
ENTER
CODE
RZ
SERIES
Vertical
(Z-Axis)
Compression
Multi-Rows
0.050” Spacing
Open-Field
HEIGHT
100 – 0½100”
150 – 0.150”
200 – 0½200”
250 – 0.250”
300 – 0.300”
350 – 0.350”
COLUMNS
10 – 10 Columns
15 – 15 Columns
20 – 20 Columns
25 – 25 Columns
ROWS
2 – 2 Rows
3 – 3 Rows
4 – 4 Rows
5 – 5 Rows
6 – 6 Rows
7 – 7 Rows
PLATING
5 – 50 µ” Au
TYPE
00 – No Polarization
VARIATION
Blank – None
XXX – Consult Factory
CONTACT
11 – Double Compression
HARDWARE
10 –
ؽ090”
Thru-Hole
20 –
Ø
.050” Guide Pin
MATED HEIGHT
Mated height is defined as the space between the hardware clamping surfaces (top hardware
surface to bottom hardware surface½) See Table 1½
MATERIALS and FINISHES
Contact: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ BeCu C17200 per ASTM B194 (brush alloy 190)
Contact Finish: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½Gold per ASTM B488 over nickel per SAE AMS-QQ-N-290
Molded Insulator: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
Glass-filled polyphenylene sulfide (PPS) per MIL-M-24519
Hardware: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
Stainless steel per ASTM A582/582M, passivated per SAE AMS-2700
NOTE: AirBorn can manufacture special configurations to your exact specifications.
PERFORMANCE
SI DATA – Differential 100 Ohm
1
2
3
4
Diff. Insertion Loss
Diff. Return Loss
NEXT
FEXT
3.0 GHz @ -3 dB
1.0 GHz @ -20 dB
2.0 GHz @ -50 dB
2.0 GHz @ -48 dB
Contact Compression: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 0½010 inches per side (nominal) for 0½100” and
0.150” connector heights; 0.015” per side (nominal)
for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Compression Force: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½25-40
grams per contact having a 0.010” deflection
35-50 grams per contact having a 0.015” deflection
Contact Wipe: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
≈0.007” for 0.100” and 0.150” connector heights
≈0.014” for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Current Rating:
½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
0.5 amperes
Contact Resistance: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
0.025 ohms typical (contact height-dependent)
Operating Temperature:
½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
-65° C to +125° C
Insulation Resistance: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
5,000 megaohms minimum @ 100 VDC
Durability:
½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
50 connector mating cycles
Dielectric Withstanding:
½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
250 VDC @ sea level, 100 VDC @ altitude
NOTE: Performance values are estimates at this time. Actual values will be determined
when final product testing is complete.
PATENT PENDING
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(512 ) 863-5585
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RZ DRAWINGS
Guide Pin Hardware Option
PWB Layout
Note: All dimensions are in inches.
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
PATENT PENDING
www.airborn.com
(512 ) 863-5585
RZ-01a-A
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RZ DRAWINGS
Thru-Hole Hardware Option
PWB Layout
Note: All dimensions are in inches.
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
PATENT PENDING
www.airborn.com
(512 ) 863-5585
RZ-01b-A
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RZ DRAWINGS
Board Footprint
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
PATENT PENDING
www.airborn.com
(512 ) 863-5585
RZ-03-
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