PC123J00000F Series
PC123J00000F
Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■
Description
PC123J00000F Series
contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
■
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No.
PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No.
PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No.
PC123)
4. Approved by DEMKO, EN60065, EN60950 (as mod-
el No.
PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No.
PC123)
6. Approved by FIMKO, EN60065, EN60950, (as mod-
el No.
PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE (DIN EN60747-5-2
(∗)
) (as an op-
tion), file No. 40008087 (as model No.
PC123)
9. Package resin : UL flammability grade (94V - 0)
(∗)
■
Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at I
F
=5 mA,
V
CE
=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(V
iso(rms)
: 5.0 kV)
8. Lead-free and RoHS directive compliant
DIN EN60747-5-2 : successor standard of DIN VDE0884
■
Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A02904EN
Date Sep. 1. 2006
© SHARP Corporation
PC123J00000F Series
■
Internal Connection Diagram
1
4
1
2
3
2
3
4
Anode
Cathode
Emitter
Collector
■
Outline Dimensions
1. Through-Hole [ex.
PC123J00000F]
Anode mark
1.2
±0.3
0.6
±0.2
Rank mark
Factory identification mark
Date code
Rank mark
Factory identification mark
Date code
1
4
(Unit : mm)
2. Through-Hole (VDE option) [ex.
PC123YJ0000F]
Anode mark
1.2
±0.3
0.6
±0.2
1
4
4.58
±0.30
P C 12 3
2
3
PC123
2
4
6.5
±0.3
3
6.5
±0.3
2.54
±0.25
2.54
±0.25
4.58
±0.30
SHARP mark "S"
VDE
idenfication mark
7.62
±0.30
4.58
±0.30
0.5
TYP.
3.5
±0.5
7.62
±0.30
4.58
±0.30
0.5
TYP.
3.5
3.5
±0.5
3.0
±0.5
2.7
±0.5
Epoxy resin
0.26
θ
θ
: 0 to 13˚
±0.10
0.26
±0.10
θ
θ
: 0 to 13˚
θ
2.7
±0.5
Epoxy resin
0.5
±0.1
θ
0.5
±0.1
Product mass : approx. 0.23g
3. Wide Through-Hole Lead-Form [ex.
PC123FJ0000F]
±0.25
Product mass : approx. 0.23g
4. Wide Through-Hole Lead-Form (VDE option) [ex.
PC123FYJ000F]
±0.25
Rank mark
Anode mark
±0.3
±0.2
Factory identification mark
±0.3
Rank mark
Anode mark
Factory identification mark
2.54
1.2
1.2
0.6
0.6
1
4
1
4
2.54
±0.2
Date code
Date code
4
±0.1
±0.30
±0.1
1.0
1.0
SHARP mark "S"
4.58
6.5
±0.3
6.5
±0.3
7.62
±0.30
VDE
idenfication mark
4.58
2
PC123
3
2
PC123
3
±0.30
7.62
±0.30
4.58
±0.30
4.58
±0.30
3.5
±0.5
2.7
MIN.
2.7
MIN.
Epoxy resin
0.26
10.16
±0.50
±0.10
Epoxy resin
0.26
±0.10
0.5
±0.1
10.16
±0.50
0.5
±0.1
Product mass : approx. 0.23g
Product mass : approx. 0.23g
Sheet No.: D2-A02904EN
2
±0.5
3.0
±0.5
PC123J00000F Series
(Unit : mm)
5. SMT Gullwing Lead-Form [ex.
PC123PJ0000F]
Rank mark
Anode mark
Factory identification mark
6. SMT Gullwing Lead-Form (VDE option) [ex.
PC123PYJ000F]
Rank mark
Anode mark
Factory identification mark
Date code
1
4
2.54
±0.25
1.2
±0.3
1.2
±0.3
0.6
±0.2
1
4
0.6
±0.2
Date code
2.54
±0.25
4.58
±0.30
4.58
±0.30
2
PC123
6.5
±0.3
3
2
PC123
4
6.5
±0.3
3
SHARP mark "S"
7.62
0.26
±0.10
±0.30
4.58
±0.30
VDE
idenfication mark
7.62
±0.30
0.35
±0.25
3.5
±0.5
0.26
±0.10
0.35
±0.25
4.58
±0.30
3.5
±0.5
1.0
+0.4
−0.0
2.54
±0.25
Date code
4
3
1.0
+0.4
−0.0
Epoxy resin
10.0
+0.0
−0.5
1.0
+0.4
−0.0
2.54
±0.25
1.0
+0.4
−0.0
Epoxy resin
10.0
+0.0
−0.5
Product mass : approx. 0.22g
7. Wide SMT Gullwing Lead-Form [ex.
PC123FPJ000F]
Rank mark
Product mass : approx. 0.22g
8. Wide SMT Gullwing Lead-Form (VDE option) [ex.
PC123ZYJ000F]
Rank mark
Anode mark
±0.3
±0.2
Factory identification mark
Anode mark
1.2
±0.3
0.6
±0.2
Factory identification mark
1.2
Date code
1
4
0.6
1
4.58
±0.30
2
PC123
6.5
±0.3
3
2
PC123
4
6.5
±0.3
±0.1
±0.1
2.54
±0.25
1.0
1.0
0.25
±0.25
0.26
±0.10
3.5
±0.5
2.54
±0.25
7.62
±0.30
4.58
±0.30
4.58
±0.30
SHARP mark "S"
VDE
idenfication mark
7.62
±0.30
0.25
±0.25
0.26
±0.10
4.58
±0.30
3.5
±0.5
0.5
±0.1
0.75
±0.25
Sheet No.: D2-A02904EN
Epoxy resin
0.75
±0.25
10.16
±0.50
12.0
MAX
0.75
±0.25
0.5
±0.1
Epoxy resin
0.75
±0.25
10.16
±0.50
12.0
MAX
Product mass : approx. 0.22g
Product mass : approx. 0.22g
3
PC123J00000F Series
Date code (2 digit)
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
·
·
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
P
R
S
T
U
V
W
X
A
B
C
·
·
·
repeats in a 20 year cycle
Factory identification mark and Plating material
Factory identification Mark
no mark
Japan
Indonesia
or
China
SnCu (Cu : TYP. 2%)
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the production.
Country of origin
Plating material
SnCu (Cu : TYP. 2%)
SnBi (Bi : TYP. 2%)
SnCu (Cu : TYP. 2%)*
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02904EN
4
PC123J00000F Series
■
Absolute Maximum Ratings
Parameter
Symbol
Forward current
I
F
*1
Peak forward current
I
FM
Reverse voltage
V
R
Power dissipation
P
Collector-emitter voltage V
CEO
Emitter-collector voltage V
ECO
I
C
Collector current
Collector power dissipation
P
C
P
tot
Total power dissipation
*2
Isolation voltage
V
iso (rms)
T
opr
Operating temperature
T
stg
Storage temperature
*3
Soldering temperature
T
sol
(T
a
=25˚C)
Rating
Unit
50
mA
1
A
V
6
70
mW
V
70
6
V
50
mA
150
mW
200
mW
5.0
kV
−30
to
+100
˚C
−55
to
+125
˚C
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■
Electro-optical Characteristics
Parameter
Symbol
Forward voltage
V
F
I
R
Reverse current
Terminal capacitance
C
t
Collector dark current
I
CEO
Collector-emitter breakdown voltage BV
CEO
Emitter-collector breakdown voltage BV
ECO
Collector current
I
C
Collector-emitter saturation voltage V
CE (sat)
Isolation resistance
R
ISO
C
f
Floating capacitance
f
c
Cut-off frequency
t
r
Rise time
Response time
t
f
Fall time
Conditions
I
F
=20mA
V
R
=4V
V=0, f=1kHz
V
CE
=50V,
I
F
=0
I
C
=0.1mA,
I
F
=0
I
E
=10µA,
I
F
=0
I
F
=5mA,
V
CE
=5V
I
F
=20mA,
I
C
=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
V
CE
=5V,
I
C
=2mA,
R
L
=100Ω,
−3dB
Output
Input
Input
Output
Transfer
charac-
teristics
V
CE
=2V,
I
C
=2mA,
R
L
=100Ω
MIN.
−
−
−
−
70
6
2.5
−
5×10
10
−
−
−
−
TYP.
1.2
−
30
−
−
−
−
0.1
1×10
11
0.6
80
4
3
MAX.
1.4
10
250
100
−
−
20
0.2
−
1.0
−
18
18
(T
a
=25˚C)
Unit
V
µA
pF
nA
V
nA
mA
V
Ω
pF
kHz
µs
µs
Sheet No.: D2-A02904EN
5
Embedded System
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