Power Modules
PRODUCT GUIDE
CONTENTS
1.
2.
3.
4.
5.
6.
Product List
Introduction to the Products and Their Features
Structure and Dimensions
Power Module Packages
System Diagram of Power Module Products
Power Module Product Matrix
Power Transistor Modules
3
4
5
6
6
7
8
8
9
10
11
12
13
14
15
20
21
22
23
23
7. Product Line-ups Listed by Package
S-10 Series MP4005~, MP4101~
S-12 Series MP4301~, MP6301
F-12 Series MP4501~, MP6901
Power MOSFET Modules
8.
9.
10.
11.
12.
13.
14.
S-10M Series MP4208~
S-12M Series MP4410~, MP6404
F-12M Series MP4711
Toshiba Power Module Products
Applications and Line-ups
Typical Applications
Dimensions of Power Module Packages
Power Module Packing
Final-Phase Production List
List of Discontinued Products
External Appeaiance of Power Modules
Discrete power devices
Power modules
PNP
×
3 + NPN
×
3
(NPN or PNP)
×
4
+ flyback diode
×
4
2
Product List
Modules
Power
3
Product No.
MP4005
MP4006
MP4009
MP4013
MP4015
MP4020
MP4021
MP4024
MP4025
MP4101
MP4104
MP4208
MP4209
MP4210
MP4211
MP4212
MP4301
MP4303
MP4304
MP4305
MP4410
Page
8
8
8
8
8
8
8
8
8
8
8
11
11
11
11
11
9
9
9
9
12
Product No.
MP4411
MP4412
MP4501
MP4502
MP4503
MP4504
MP4506
MP4507
MP4508
MP4513
MP4514
MP4711
MP6301
MP6404
MP6901
Page
12
12
10
10
10
10
10
10
10
10
10
13
9
12
10
Introduction to the Products and Their Features
Rapid advances are being made in the miniaturization and level of integration of
electronic devices, not only in the signal processing stages but also in the power
stages.
Intelligent power devices, hybrid ICs and SMD technologies (among others) have
helped to achieve these advances, but power module technology is the structur-
ally simplest means of providing multiple elements in a single unit.
Power modules enable power devices to be easily mounted at high densities, and
are ideal for use in general-purpose solenoid drives, matrix LED drives, printer
head pin drives and as the power drivers for small motors such as stepping mo-
tors, forward-reverse control motors and 2-phase to 5-phase motors.
Modules
Power
Features of MP Series
of Power Modules
MP Series Features
1
Discrete multi-chip products
Stable operation is enabled without parasitic elements such as ICs between units.
Low loss and durability of discrete elements is maintained.
Can be used in high-power applications because of the greater permissible loss and
because operating temperatures are limited only by junction temperatures.
2
3
4
Voltage rating: 60 V~120 V. Current rating: 1.5 A~10 A
Line-ups include three package types and eight types of circuit structure.
Wide range of built-in chips.
MOS
4-V drive MOSFETs
With built-in surge-adsorber
Zener diodes
*
Built-in FWD
No FWD
Bipolar
Darlington
High-β (high-h
FE
, Low-V
CE
(sat) single-transistor)
BRT (built-in bias resistor)
*
Zener voltage variation: 60 V
±
10 V, 80 V
±
10 V, 100 V
±
15 V
FWD: Flywheel diode
4
Structure and Dimensions
Toshiba's power modules are basically structured as multi-chip units with multiple discrete chips such as transistors
and diodes built onto a frame. The required circuit structure is implemented by adjusting the frame dimensions and
the bonding wire connections as required.
Power modules are therefore better suited to mass production than hybrid ICs. It is also relatively simple to develop
different types of power module with the same circuit structure, but using transistor chips with differeht characteristics.
In addition, the frame dimensions and bonding can be varied to yield a range of circuit configurations.
Figure 1 shows the internal structure of a full-mold type power module. Figure 2 shows the internal structure of a
power module with an insulated heat sink for ues in high-power applications. As shown in Figure 2, the internal
circuitry of the power module is insulated using an insulated heat sink and resin. This means that no insulation is
required when mounting the device on an external heat sink. This makes the mounting process simpler.
Figure 1. Internal structure of full-mold type
3
4
2
5
1
1
Lead
3
Bonding wire
5
Mold resin
2
Frame
4
Transistor chip
Figure 2. Internal structure of type with insulated heat sink
6
5
5
6
2
4
3
1
1
1 2
Lead
3
Bonding wire
5
Mold resin
2
Frame
4
Transistor chip
6
Heat sink
Power
5
Modules
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