BU-63705D1200 datasheet, PDF - EEWORLD Datasheet

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BU-63705D1200: DescriptionMIL-STD-1553 Data Bus Transceiver, CMOS, CDIP78, 45.70 X 53.30 MM, 5.30 MM HEIGHT, CERAMIC, DIP-78; CategoryWireless rf/communication Telecom circuit; File Size276KB，27 Pages; ManufacturerData Device Corporation

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BU-63705D1200 Overview

MIL-STD-1553 Data Bus Transceiver, CMOS, CDIP78, 45.70 X 53.30 MM, 5.30 MM HEIGHT, CERAMIC, DIP-78

BU-63705D1200 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Data Device Corporation
Parts packaging code	DIP
package instruction	DIP,
Contacts	78
Reach Compliance Code	compliant
JESD-30 code	R-CDIP-P78
JESD-609 code	e0
Negative supply voltage rating	-15 V
Number of functions	1
Number of terminals	78
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.33 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MIL-STD-1553 DATA BUS TRANSCEIVER
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

BU-63705D1200 Preview

BU-63705

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MIL-STD-1553 DUAL REDUNDANT

REMOTE TERMINAL HYBRID

SPACE-RT-II

FEATURES

•

Drop in Replacement for BU-65142

•

Radiation Tolerant & Radiation

Hardened versions for Space Based

Applications

•

Complete Integrated Remote

Terminal Including:

– Low-Power Transceivers

– Complete RT Protocol

•

Multiple Ordering Options;

+5V (Only), +5V/-15V, and +5V/-12V

•

Direct Interface to Systems with

No Processor

•

High Reliability Screening

DESCRIPTION

The BU-63705, "SPACE-RT-II", is a Hi-Rel radiation tolerant complete

dual redundant MIL-STD-1553 Remote Terminal Unit (RTU). The

SPACE-RT-II is a drop in Replacement for the BU-65142. The device

is based upon two DDC custom ICs, which includes two monolithic bi-

polar low power transceivers and one RICMOS™ protocol chip con-

taining data buffers and timing control logic. It supports all 13 mode

codes for dual redundant operation, any combination of which can be

illegalized.

Parallel data transfers are accomplished with a DMA type handshak-

ing, compatible with most CPU types. Data transfers to/from memory

are simplified by the latched command word and word count outputs.

Error detection and recovery are enhanced by BU-63705 special fea-

tures. A 14-bit built-in-test word register stores RTU information, and

sends it to the Bus Controller in response to the Mode Command

Transmit Bit Word. The BU-63705 performs continuous on-line wrap-

around self-test, and provides four error flags to the host CPU. Inputs

are provided for host CPU control of 6 bits of the RTU Status Word.

Its integrated hermetic package, -55°C to +125°C operating temper-

ature range, and complete RTU operation make the BU-63705 ideal

for MIL-STD-1553 applications requiring hardware or microprocessor

subsystems.

FOR MORE INFORMATION CONTACT:

Data Device Corporation

105 Wilbur Place

Bohemia, New York 11716

631-567-5600 Fax: 631-567-7358

www.ddc-web.com

Technical Support:

1-800-DDC-5757 ext. 7771

All trademarks are the property of their respective owners.

2005 Data Device Corporation

Data Device Corporation

www.ddc-web.com

DATA

BUS A

ENCODER/

DECODER

BIT

PROCESSOR

BUFFER

TRANSCEIVER

DB0-DB15

BUF ENA

WATCHDOG

TIMEOUT

TRANSFER

CONTROLS

DTREQ

DTGRT

DTACK

DTSTR

R/W

DATA

BUS B

ENCODER/

DECODER

BIT

PROCESSOR

TRANSCEIVER

CURRENT

WORD

COUNTER

A0-A4

A5-A10

COMMAND

LATCH

RT ADDRESS

PARITY

PROTOCOL

SEQUENCER

AND

CONTROL

LOGIC

STATUS

DAT/CMD

ILL CMD (ME)

SS REQ

ADBC

RT FLAG

SS BUSY

SS FLAG

ERROR FLAGS

MESS ERR

RT FAIL

HS FAIL

RTADD ERR

TIMING FLAGS

NBGT

INCMD

BITEN

STATEN

GBR

16 MHz CLOCK

DDC CUSTOM CHIP

BU-63705

C-02/06-0

FIGURE 1. BU-63705 SERIES BLOCK DIAGRAM

TABLE 1. SPACE-RT-II SERIES SPEC’S

PARAMETER

ABSOLUTE MAXIMUM RATING

Supply Voltage

Logic +5V

Transceiver +5V

-15V (BU-63705X1)

-12V (BU-63705X2)

Receiver Differential Input Voltage

Logic

Voltage Input Range for +5V

RECEIVER

Differential Input Impedance

(BU-63705 X1/X2) (DC to 1 MHz)

Differential Input Resistance

(BU-63705X3)

Input Threshold Level

Direct Coupled (BU-63705 X1/X2)

Transformer Coupled, Measured on

Stub (BU-63705X3)

CMRR (DC to 2 MHz)

CMV (DC to 2 MHz)

TRANSMITTER

Differential Output Voltage

Direct Coupled Across 35

Ω,

Measured on Bus

Transformer Coupled Across 70

Ω,

Measured on Stub

Output Noise, Differential (Direct

Coupled)

Output Offset Voltage, (Transformer

Coupled Across 70 ohms)

Rise/Fall Time

LOGIC

=5.5V)

= 4.5V)

= 5.5V, V

= 2.7V)

16MHz_IN

All other inputs

= 5.5V, V

= 0.0V)

16MHz_IN

All other inputs

= 4.5V, I

= max)

= 4.5V, I

= max)

= 4.5V) (Note 1)

= 4.5V)

(f = 1MHz)

MIN

TYP

MAX

UNITS

TABLE 1. SPACE-RT-II SERIES SPEC’S (CONT)

PARAMETER

POWER SUPPLY REQUIREMENTS

(CONTINUED)

Current Drain

BU-63705X1

-15V (Ch.A & Ch. B)

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X2

-12V (Ch.A & Ch. B)

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X3

+5V (Ch.A & Ch. B)

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

POWER DISSIPATION (NOTE 2)

Total Hybrid

BU-63705X1

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X2

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X3

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

Hottest Die

BU-63705X1

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X2

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

BU-63705X3

• Idle

• 25% Transmitter Duty Cycle

• 50% Transmitter Duty Cycle

• 100% Transmitter Duty Cycle

MIN

TYP

MAX

UNITS

-0.5

-18.0

6.5

7.0

0.3

40.0

Vcc+0.5

Vp-p

kΩ

-0.5

4.0

108

175

270

2.5

0.28

0.200

KΩ

1.20

0.860

Vp-p

120

185

305

±10

125

230

335

545

Vp-p

mVp-p,

diff

mVp-p,

diff

nsec

µA

-250

100

150

+250

300

1.475

1.856

2.238

3.000

1.295

1.680

2.065

2.895

0.687

0.92

1.15

1.60

0.8

-10

-400

-10

-600

+10

-20

+10

-60

0.5

-8

0.680

1.010

1.350

2.030

0.290

0.540

0.790

1.290

0.280

0.510

0.750

1.220

POWER SUPPLY REQUIREMENTS

+5V Logic Power

Logic Current Drain

BU-63705X1

+5V (Ch. A, Ch. B)

-15V (VA, VB)

BU-63705X2

+5V (Ch. A, Ch. B)

-12V (VA, VB)

BU-63705X3 (+5V Only)

+5V (Ch. A, Ch. B)

4.5

5.0

5.5

115

4.5

5.0

-15.75 -15.0

5.5

-14.25

4.5

5.0

-12.6 -12.0

5.5

-11.4

4.75

5.0

5.25

Data Device Corporation

www.ddc-web.com

BU-63705

C-02/06-0

TABLE 1. SPACE-RT-II SERIES SPEC’S (CONT)

PARAMETER

CLOCK INPUT

Frequency

• Nominal Value

• Long Term Tolerance

1553A Compliance

1553B Compliance

• Short Term Tolerance, ONE sec

1553A Compliance

1553B Compliance

• Duty Cycle

16 MHz

1553 MESSAGE TIMING

• RT -to - RT Response Timeout

• RT Response Time

• Transmitter Watchdog Timeout

THERMAL

• Thermal Resistance, Junction-to

-Case, Hottest Die (ThetaJC)

• Operating Junction Temperature

• Storage Temperature

• Lead Temperature

(soldering 10 sec.)

PHYSICAL CHARACTERISTICS

Size

78-pin Ceramic QIP (BU-63705D)

MIN

TYP

MAX

UNITS

HIGH-REL SCREENING

DDC is committed to the design and manufacture of hybrids and

transformers with enhanced processing and screening for

spaceborne applications and other systems requiring the highest

levels of reliability. These platforms include launch vehicles,

satellites and the International Space Station.

DDC has tailored its design methodologies to optimize the fabri-

cation of space level hybrids. The intent of the design guidelines

is to minimize the number of die and wirebonds, minimize the

number of substrate layers, and maximize the space between

components. DDC’s space grade products combine analog bipo-

lar and rad hard CMOS technology to provide various levels of

radiation tolerance.

The BU-63705 is packaged in a 78-pin ceramic package. In con-

trast to Kovar (metal) packages, the use of ceramic eliminates

the hermeticity problems associated with the glass beads used

in the metal packages. In addition, ceramic packages provide

more rigid leads, better thermal properties, easier wirebonding,

and lower weight.

The production of the space level hybrids can entail enhanced

screening steps beyond DDC’s standard flow. This includes

Condition A visual inspection, SEM analysis, and element evalu-

ation for all integrated circuit die. For the hybrids, additional

screening includes Particle Impact Noise Detection (PIND), 320-

hour burn-in (standard on this device), 100% non-destructive

wirebond pull (standard on this device), X-ray analysis, as well

as Destructive Physical Analysis (DPA) testing, extended tem-

perature cycling for QCI testing, and a moisture content limit of

5000 PPM. TABLE 3 summarizes the procurement screening,

element evaluation, and hybrid screening used in the production

of the BU-63705.

-0.01

-0.10

0.001

-0.01

17.5

18.5

768

19.5

0.01

0.10

0.001

0.01

MHz

µs

7.55

-55

-65

150

300

°C/W

°C

1.80 x 2.10 x 0.21

(45.7 x 53.3 x 5.3)

1.80 x 2.10 x 0.21

(45.7 x 53.3 x 5.3)

1.7

(48.2)

(mm)

(g)

78-pin Ceramic Flat Pack

(BU-63705F)

Weight

Notes (for TABLE 1):

1. Minus sign indicates the direction of current flow.

2. Power dissipation specifications assume a transformer coupled configuration,

with external dissipation (while transmitting) of 0.14 watts for the active isolation

transformer, 0.08 watts for the active coupling transformer, 0.45 watts for each of

the two bus isolation resistors, and 0.15 watts for each of the two bus termination

resistors.

RADIATION TOLERANCE

The hybrids are inherently immune to Latchup. The transceiver is

bipolar/BiCMOS, the digital logic is implemented in a Honeywell

RICMOS™ IV SOI Gate Array (HX2000 Series).

TABLE 2. BU-63705 SERIES

RADIATION SPECIFICATIONS*

PART

NUMBER

TOTAL

DOSE

SINGLE EVENT

UPSET

SINGLE EVENT

LATCHUP

BU-63705

X1/X2

300K

Rad*

1.0 x 10

-8

errors/device-day,

(LET Threshold of

63 MeV-cm

/mg)

1.0 x 10

-8

errors/device-day,

(LET Threshold of

63 MeV-cm

/mg)

Immune

BU-63705

100K

Rad

Immune

* Consult factory for 1 X 106 Rad Version

*Note: Radiation parameters specified on this data sheet are derived from initial

qualification testing by

DDC

and published data from

ASIC

manufacturers. These

devices have not been evaluated for compliance to the

RHA

requirements stipu-

lated in MIL-PRF-38534,

Appendix G.

Data Device Corporation

www.ddc-web.com

BU-63705

C-02/06-0

TABLE 3. HIGH RELIABILITY SCREENING OPTIONS

ELEMENT EVALUATION

Visual Inspection:

Integrated Circuits

Transistors & Diodes

Passive Components

METHOD

MIL-STD-883, Method 2010 Condition A

MIL-STD-750, Method 2072 and 2073

MIL-STD-883, Method 2032 Class S

SEM Analysis for Integrated

MIL-STD-883, Method 2018

Circuits

Element Evaluation:

Visual, Electrical, Wire

Bondability, 24-Hour

Stabilization Bake,10

Temperature Cycles

5000 g’s constant acceleration MIL-PRF-38534

240-Hour Powered Burn-In

and 1000-Hour Life Test

(Burn-In and 1000-Hour Life

Test Are Only Required For

Active Components.)

ASSEMBLY & TEST

Particle Impact Noise

Detection (PIND)

320-Hour Burn-In

(standard on this device)

100% Non-Destructive

Wirebond Pull

(standard on this device)

Radiographic (X-Ray)

Analysis

QCI TESTING

Extended Temperature

Cycling:

20 Cycles Including

Radiographic (X-Ray)

Testing

Moisture Content Limit of

5000 PPM

MIL-STD-883, Method 2020 Condition A

MIL-STD-883, Method 1015

The BU-63705 allows the subsystem host CPU to control 6 of the

bits in the RTU status word. Of particular interest is the Illegal

Command input which may be used to set the message error bit

and illegalize any command word. The BU-63705 provides four

error flags to the subsystem host CPU for evaluating its condition.

In addition a continuous on-line self-test is performed by the BU-

63705 on every transmission. The last Transmitted Word of every

message is wrapped around into the decoder and compared with

the Actual Word. Any discrepancy is flagged as an error.

TIMING

Interfacing the subsystem host CPU to the BU-63705 is simple

and compatible with most microprocessors. FIGURES 4 and 5

illustrate typical MIL-STD-1553 messages for Transmit data and

Receive data. FIGURES 6 and 7 illustrate RT to RT transfers. In

each case NBGT identifies the start of the message, and INCMD

identifies that a command is being processed. The handshake

sequence DTREQ, DTGRT, and DTACK is used to transfer each

word over the parallel data highway. DTSTR and RD/WR are

used to control transfers to RAM memory. GBR identifies a “good

block received”, when a received message has passed all valida-

tion checks and has the correct word count. BUFENA (Buffer

Enable) must be applied to enable the internal tri-state buffers.

ERROR FLAGS

MIL-STD-883, Method 2023

Four error flags are output to the subsystem to provide informa-

tion on the condition of the BU-63705.

1. The ME (Message Error) line goes LOW if any of the follow-

ing error conditions exist:

• format error

• word count error

• invalid word

• sync error

• RT to RT address error

• T/R bit error

2. The RTFAIL (Remote Terminal Failure) line goes LOW when-

ever the results of a continuous wraparound self-test shows

a discrepancy, or a transmitter watchdog timeout has

occurred.

3. The HSFAIL (Handshake Failure) line goes LOW whenever

the system does not issue a DTGRT in response to a

DTREQ before timing-out.

4. The RTADR ERR (RT Address Error) line goes LOW when-

ever the sum of the 5 address lines and parity lines show a

parity error (the terminal will not respond to commands while

this error condition exists).

MIL-STD-883, Method 2012

MIL-STD-883, Method 1010 Condition C

and MIL-STD-883, Method 2012

MIL-STD-883, Method 1018

INTRODUCTION

The BU-63705 is a complete dual redundant Remote Terminal

Unit (RTU). It is fully compliant with MIL-STD-1553B and supports

all message formats. As shown in FIGURE 1, it includes 2 trans-

ceivers and a custom chip containing 2 encoders / decoders, 2 bit

processors, an RTU protocol sequencer and control logic, output

latches, and buffers. With the addition of 2 data bus transformers,

the BU-63705 is ready for connection to a MIL-STD-1553 data

bus.

Data is transferred to and from the subsystem host CPU over a 16-

bit parallel highway, which is isolated by a set of bi-directional buffers.

All transfers are made with a DMA type handshake sequence of

request, grant and acknowledge. Read/write and data strobes are

provided to simplify interfacing to external RAM. Also simplifying the

RAM interface is the availability of a latched command word and an

auto-incrementing word counter. These signals may be used as an

address to map the data directly to and from RAM.

Data Device Corporation

www.ddc-web.com

BU-63705

C-02/06-0

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