F-219
QSH–060–01–L–D–DP–A
QSH–060–01–L–D–A–K
®
QSH–030–01–F–D–A
(0.50 mm) .0197"
QSH SERIES
HIGH-SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QTH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
Blade &
Beam
Design
Integral metal plane
for power or ground
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
POWER/SIGNAL
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
25
G b p s
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QSH
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
(60 total pins per bank = –D)
–030, –060, –090
–020, –040, –060
(20 pairs per bank = –D–DP)
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-
Ended
–D
FILE NO. E111594
–D = (No. of Pins per Row/30) x
(20.00) .7875 + (1.27) .050
–DP = (No. of Pairs per Row/20) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= Differential
Pair
(–01 only)
–D–DP
= (8.25 mm)
.325" DIA
Polyimide Film
Pick & Place Pad
–K
= Tape & Reel
(–090 positions
maximum)
–TR
–L
STANDARDS
• PISMO 1
Visit www.samtec.com/standards
for more information.
™
02
(7.49)
.295
01
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.50)
.0197
(0.15)
.006
(3.05)
.120
(7.24)
.285 (0.76)
.030
(0.89)
.035
DIA
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins
in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
(3.25)
.128
*Note:
–C Plating passes
10 year MFG testing
–C*
= Latching
Option
(Not available on
–060 (–D–DP)
& –090 positions)
QTH
MATED HEIGHT
LEAD STYLE
WITH QSH*
–01
–02
–03
–04
–05
–07
–09
(5.00) .197
(8.00) .315
(11.00) .433
(16.00) .630
(19.00) .748
(25.00) .984
(14.00) .551
–L
(0.64)
.025
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
