BQ500212ARGZT datasheet, PDF - EEWORLD Datasheet

BQ500212ARGZT: DescriptionQi Compliant 5V Wireless Power Transmitter Manager 48-VQFN 0 to 0; CategoryWireless rf/communication Telecom circuit; File Size23KB，2 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Qi Compliant 5V Wireless Power Transmitter Manager 48-VQFN 0 to 0

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	HVQCCN,
Reach Compliance Code	compli
ECCN code	EAR99
JESD-30 code	S-PQCC-N48
JESD-609 code	e4
length	7 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
Maximum operating temperature	110 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
Base Number Matches	1

	BQ500212ARGZT	BQ500212ARGZR
Description	Qi Compliant 5V Wireless Power Transmitter Manager 48-VQFN 0 to 0	Qi Compliant 5V Wireless Power Transmitter Manager 48-VQFN 0 to 0
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
package instruction	HVQCCN,	HVQCCN,
Reach Compliance Code	compli	compli
JESD-30 code	S-PQCC-N48	S-PQCC-N48
JESD-609 code	e4	e4
length	7 mm	7 mm
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	48	48
Maximum operating temperature	110 °C	110 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260
Maximum seat height	1 mm	1 mm
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	7 mm	7 mm
Base Number Matches	1	1

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