EEWORLDEEWORLDEEWORLD

Part Number

Search

IDT7187L85EB

Description
Standard SRAM, 64KX1, 85ns, CMOS, CDFP24, 0.300 INCH, CERPACK-24
Categorystorage    storage   
File Size76KB,8 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

IDT7187L85EB Overview

Standard SRAM, 64KX1, 85ns, CMOS, CDFP24, 0.300 INCH, CERPACK-24

IDT7187L85EB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeDFP
package instructionDFP, FL24,.4
Contacts24
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Maximum access time85 ns
I/O typeSEPARATE
JESD-30 codeR-GDFP-F24
JESD-609 codee0
length15.748 mm
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width1
Number of functions1
Number of ports1
Number of terminals24
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64KX1
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height2.286 mm
Maximum standby current0.0006 A
Minimum standby current2 V
Maximum slew rate0.09 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width9.144 mm
CMOS STATIC RAM
64K (64K x 1-BIT)
Integrated Device Technology, Inc.
IDT7187S
IDT7187L
FEATURES:
• High speed (equal access and cycle time)
— Military: 20/25/35/45/55/70/85ns (max.)
— Commercial: 15/20/25ns (max.)
• Low power consumption
• Battery backup operation—2V data retention (L version
only)
• JEDEC standard high-density 22-pin plastic and ceramic
DIP, 22-pin and 28-pin leadless chip carrier and 24-pin
CERPACK
• Produced with advanced CMOS high-performance
technology
• Separate data input and output
• Input and output directly TTL-compatible
• Military product compliant to MIL-STD-883, Class B
DESCRIPTION:
The IDT7187 is a 65,536-bit high-speed static RAM
organized as 64K x 1. It is fabricated using IDT’s high-
performance, high-reliability CMOS technology. Access times
as fast as 15ns are available.
Both the standard (S) and low-power (L) versions of the
IDT7187 provide two standby modes—I
SB
and I
SB1
. I
SB
provides low-power operation; I
SB1
provides ultra-low-power
operation. The low-power (L) version also provides the capa-
bility for data retention using battery backup. When using a 2V
battery, the circuit typically consumes only 30µW.
Ease of system design is achieved by the IDT7187 with full
asynchronous operation, along with matching access and
cycle times. The device is packaged in an industry standard
22-pin, 300 mil plastic or ceramic DIP, 22- and 28-pin leadless
chip carriers, or 24-pin CERPACK.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B, making it ideally
suited to military temperature applications demanding the
highest level of performance and reliability.
FUNCTIONAL BLOCK DIAGRAM
A
A
V
CC
A
A
A
A
A
ROW
SELECT
65,536-BIT
MEMORY ARRAY
GND
CS
DATA
IN
COLUMN I/O
DATA
OUT
WE
A
A
A
A
A
A
A
2986 drw 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
©1994
Integrated Device Technology, Inc.
MAY 1994
DSC-1025/4
6.1
1
How should a novice who has just started working in mobile phone RF improve himself?
First, you should have a systematic understanding of the RF system ( such as functionality ) , then you can select some chipsets and study the connectivity among them ....
JasonYoo RF/Wirelessly
RDA COM RF transceiver realizes on-chip integration of sensitive components such as RF front-end, VCO, loop filter, etc.
The design of new generation wireless communication products is becoming more and more complex and powerful. As an important component of communication chips, highly integrated RF transceivers are cru...
songbo RF/Wirelessly
4-layer board design help, PCB antenna layout problem?
As shown in the picture, the PCB is being laid out. If I arrange it this way, the WPS button will be next to the antenna. Will this layout cause interference to the antenna? Will the impact be signifi...
okhxyyo PCB Design
About the startup problem of ZVS high voltage resonant circuit
[i=s]This post was last edited by Yin Zijing on 2021-4-3 16:22[/i]I came across a video about ZVS by chance. The following figure is the first version of the circuit diagram, which is also a typical Z...
寅子敬 Analog electronics
Several hidden security tools in WinXP
Several hidden security tools in WinXPIn Windows XP, there are more than 100 various tools hidden on the installation CD, which cover all aspects of the operating system, from network, Internet connec...
wo2000ailuo RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 544  370  1705  1588  1331  11  8  35  32  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号