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DP5Z1MM16PH3-12I

Description
Flash, 1MX16, 120ns, CQFP48, HERMETIC SEALED, GULLWING, SLCC-48
Categorystorage    storage   
File Size5MB,21 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DP5Z1MM16PH3-12I Overview

Flash, 1MX16, 120ns, CQFP48, HERMETIC SEALED, GULLWING, SLCC-48

DP5Z1MM16PH3-12I Parametric

Parameter NameAttribute value
MakerB&B Electronics Manufacturing Company
Parts packaging codeQFP
package instructionHERMETIC SEALED, GULLWING, SLCC-48
Contacts48
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
Other features100K WRITE AND ERASE CYCLES; HARDWARE DATA PROTECTION
JESD-30 codeR-CQFP-G48
memory density16777216 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX16
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAQFP
Package shapeRECTANGULAR
Package formFLATPACK, PIGGYBACK
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height2.794 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
typeNOR TYPE
1Mx16, 120 - 200ns, STACK/PGA
30A162-21
A
16 Megabit FLASH EEPROM
DP5Z1MM16PY/I3/H3/J3/DP5Z1MW16PA3
PRELIMINARY
DESCRIPTION:
The DP5Z1MM16PY/I3/H3/J3/DP5Z1MW16PA3 ‘’SLCC’’ devices are a
revolutionary new memory subsystem using Dense-Pac Microsystems’
ceramic Stackable Leadless Chip Carriers (SLCC). Available unleaded,
straight leaded, ‘’J’’ leaded, gullwing leaded packages, or mounted on a
50-pin PGA co-fired ceramic substrate. The Device packs 16-Megabits of
FLASH EEPROM in an area as small as 0.463 in
2
, while maintaining a total
height as low as 0.110 inches.
The DP5Z1MM16PY/I3/H3/J3/DP5Z1MW16PA3 is a 1 Meg x 16 FLASH
EEPROM memory devices. Each SLCC is hermetically sealed making the
module suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
DP5Z1MM16PY
DP5Z1MM16PI3
FEATURES:
Organization: 1 Meg x 16
Fast Access Times: 120, 150, 200ns (max.)
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 64 Kbyte Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during
Power Transitions
Packages Available:
DP5Z1MM16PY
48 - Pin SLCC
DP5Z1MM16PI3
48 - Pin Straight Leaded SLCC
DP5Z1MM16PH3 48 - Pin Gullwing Leaded SLCC
DP5Z1MM16PJ3
48 - Pin ‘’J’’ Leaded SLCC
DP5Z1MX16PA3
50 - Pin PGA Dense-SLCC
DP5Z1MM16PJ3
DP5Z1MW16PA3
DP5Z1MM16PH3
30A162-21
REV. B
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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