ZTTCC3.58MG
1. SCOPE
This specification shall cover the characteristics of the ceramic
resonator with the type ZTTCC3.580MG.
2. PART NO.:
PART NUMBER
CUSTOMER PART NO SPECIFICATION NO
ZTTCC3.580MG
3. OUTLINE DRAWING AND DIMENSIONS:
Appearance: No visible damage and dirt.
Dimensions:
UINT: mm
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ZTTCC3.58MG
4. ELECTRICAL SPECIFICATIONS:
No
Item
Requirements
4.1 Oscillation Frequency Fosc
（MHz）
3.5800
Frequency Accuracy (%)
±0.5
4.2 Resonant Impedance Ro (Ω)max
30
4.3
Temperature Coefficient of
±0.3
(Oscillation Frequency
Oscillation Frequency (%) max
drift -20℃ to +80℃)
4.4
Withstanding Voltage
50 VDC, 1 min
4.5
Rating Voltage U
R
(V)
(1) D.C. Voltage
6 VDC.
(2) A.C. Voltage
15 Vp-p.
4.6 Insulation Resistance Ri,
（MΩ）
min
100 ( 100V, 1min)
4.7
Operating Temperature (℃)
-40½+85
4.8
Storage Temperature
(℃)
-55½+85
4.9
Aging Rate (%) max
±0.3
(For 10 years)
5. MEASUREMENT:
Measurement Conditions: Parts shall be measured under a condition
( Temp.
：
20±15
℃
,Humidity
：
65±20% R.H.) unless the standard
condition(Temp.
：
25±3
℃
,Humidity
：
65±5% R.H.) is regulated to
measure.
Test
Circuit:
IC：1/6TC4069UBP×2
X：CERAMIC RESONATOR
6.PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
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ZTTCC3.58MG
No
6.1
Item
Humidity
Condition of Test
Keep the resonator at 40±2℃ and 90-95% RH
for 96±4 hours. Then Release the resonator into
the room Condition for 1 hour prior to the
Measurement.
Subject the resonator to vibration for 2 hours
each in x、y and z axis With the amplitude of
1.5mm, the frequency shall be varied uniformly
between the limits of 10 Hz—55Hz.
Drop the resonator randomly onto a wooden
floor from the height of 100cm 3 times.
Performance
Requirements
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
6.2
Vibration
6.3
Mechanical
Shock
6.4
Soldering
Test
6.5
Solder
Ability
6.6
High
Temperature
Exposure
Low
Temperature
Exposure
6.7
Passed through the re-flow oven under the
following condition and left at room
temperature for 1 hour before measurement.
Temperature at the surface of the
Time
substrate
Preheat 150±5℃
60±10
sec
Peak
240±5℃
10±3 sec
Dipped in 230±5℃ solder bath for 3±0.5 sec The terminals
seconds with rosin flux (25wt% ethanol shall be at
solution.)
least
95%
covered
by
solder.
Subject the resonator to 80±5℃ for 96 hours, It shall fulfill
then release the resonator into the room the
conditions for 1 hour prior to the measurement. specifications
in Table 1.
Subject the resonator to -20±5℃ for 96 hours, It shall fulfill
then release the resonator into the room the
conditions for 1 hour prior to the measurement. specifications
in Table 1.
6. PHYSICAL AND ENVIRONMENAL CHARACTERISICS
(Continued from the preceding page)
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ZTTCC3.58MG
No
6.8
Item
Temperature
Cycling
Performance
Requirements
Subject the resonator to -40℃ for 30 It shall fulfill the
min. followed by a high temperature of specifications
in
85℃ for 30 min.
Table 1.
Cycling shall be repeated 5 times with a
transfer time of 15 sec. At the room
temperature for 1 hour prior to the
measurement.
Mount
a
glass-epoxy
board Mechanical damage
such as breaks shall
(Width=40mm,thickness=1.6mm),then
bend it to 1mm displacement and keep it not occur.
for 5 seconds. (See the following figure)
PRESS
Condition of Test
6.9
Board
Bending
PRESS HEAD
SUPPORT BAR
TABLE 1
Item
Oscillation Frequency Change
△Fosc/Fosc
(%) max
Resonant Impedance Change
△Ro(Ω)max
Specification
±0.3
±10
Note: The limits in the above table are referenced to the initial
measurements.
6. REVIEW OF SPECIFICATIONS
When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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ZTTCC3.58MG
7. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
8.1Recommended land pattern
DIMENSIONS (mm)
T
1
1.5±0.3
T
2
1.7±0.3
T
3
2.5±0.3
W
1
3.58±0.3
8.2Recommended reflow soldering standard conditions
within 10 sec
Temperature(
℃
)
℃
Pre-heating
within
80-120sec.
within
20-40sec
8. PACKAGE
To protect the products in storage and transportation
，
it is
necessary to pack them（outer and inner package）.On paper pack, the
following requirements are requested.
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