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DAN217U

Description
0.1 A, 2 ELEMENT, SILICON, SIGNAL DIODE
Categorysemiconductor    Discrete semiconductor   
File Size207KB,3 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
Download Datasheet View All

DAN217U Overview

0.1 A, 2 ELEMENT, SILICON, SIGNAL DIODE

MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
DAN217U
Features
Low Current Leakage
Low Cost
Small Outline Surface Mount Package
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
C/A
Moisture Sensitivity Level 1
Pin Configuration
Top View
200mW
80Volt
Plastic-Encapsulate
Diode
SOT-323
A
D
A7
A
C
Maximum Ratings
Operating Temperature: -40°C to +150°C
Storage Temperature: -55°C to +150°C
F
E
B
C
Electrical Characteristics @ 25 Unless Otherwise Specified
°C
Parameter
Peak reverse voltage
DC reverse voltage
Maximum forward current
Average forward current
Surge current
Power dissipation
Junction temperature
Symbol
V
RM
V
R
I
FM
I
O
I
FSM
P
D
Tj
Limits
80
80
300
100
1000
200
150
Unit
V
V
mA
mA
mA
mW
DIM
A
B
C
D
E
F
G
H
J
K
K
DIMENSIONS
G
H
J
INCHES
MIN
MAX
.071
.087
.045
.053
.079
.087
.026 Nominal
.047
.055
.012
.016
.000
.004
.035
.039
.004
.010
.012
.016
MM
MIN
MAX
1.80
2.20
1.15
1.35
2.00
2.20
0.65Nominal
1.20
1.40
.30
.40
.000
.100
.90
1.00
.100
.250
.30
.40
NOTE
Parameter
Reverse breakdown voltage
Reverse voltage leakage
current
Forward voltage
Symbol Test conditions
V
BR
I
R
V
F
IR=100uA
VR=70V
IF=100mA
MIN
80
MAX
UNIT
V
Suggested Solder
Pad Layout
0.70
0.2
1200
uA
0.90
mV
1.90
0.65
0.65
Revision:
A
www.mccsemi.com
1 of 3
2011/01/01
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