IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| INS8250AN/A+ | INS8250AWN | PC8250CV | PC8250CN | INS8250N-B/A+ | INS8250J-B | INS8250J-B/A+ | |
|---|---|---|---|---|---|---|---|
| Description | IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,PLASTIC | IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,PLASTIC | IC,UART,CMOS,LDCC,44PIN,PLASTIC | IC,UART,CMOS,DIP,40PIN,PLASTIC | IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,PLASTIC | IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,CERAMIC | IC,COMMUNICATIONS INTERFACE,MOS,DIP,40PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | R-XDIP-T40 | R-XDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 40 | 44 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | QCCJ | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | NO | NO |
| technology | MOS | MOS | CMOS | CMOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
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