IBM0118160T3-80 datasheet, PDF

IBM0118160T3-80: DescriptionFast Page DRAM, 1MX16, 80ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44; Categorystorage storage; File Size1MB，27 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

Download Datasheet Parametric Compare View All

IBM0118160T3-80 Overview

Fast Page DRAM, 1MX16, 80ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44

Parameter Name	Attribute value
Maker	IBM
Parts packaging code	TSOP2
package instruction	TSOP2,
Contacts	50
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	80 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDSO-G44
length	20.95 mm
memory density	16777216 bit
Memory IC Type	FAST PAGE DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	44
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
width	10.16 mm

	IBM0118160T3-80	IBM0118160BT3-80
Description	Fast Page DRAM, 1MX16, 80ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44	Fast Page DRAM, 1MX16, 80ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44
Maker	IBM	IBM
Parts packaging code	TSOP2	TSOP2
package instruction	TSOP2,	0.400 X 0.825 INCH, TSOP2-50/44
Contacts	50	50
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE
Maximum access time	80 ns	80 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDSO-G44	R-PDSO-G44
length	20.95 mm	20.95 mm
memory density	16777216 bit	16777216 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM
memory width	16	16
Number of functions	1	1
Number of ports	1	1
Number of terminals	44	44
word count	1048576 words	1048576 words
character code	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	1MX16	1MX16
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Certification status	Not Qualified	Not Qualified
refresh cycle	1024	1024
Maximum seat height	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	3.6 V
Minimum supply voltage (Vsup)	4.5 V	3 V
Nominal supply voltage (Vsup)	5 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL
width	10.16 mm	10.16 mm

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components