Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX25401TBV
MA001380412
PG-TO263-5-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.179
0.483
0.145
482.096
0.277
1.456
66.987
659.678
12.524
0.243
0.001
0.119
0.095
4.552
0.442
0.133
441.456
Average
Mass
[%]
0.19
0.03
0.01
28.80
0.02
0.09
4.00
39.40
0.75
0.01
0.00
0.01
0.01
0.27
0.03
0.01
26.37
18. August 2015
1673.87 mg
Sum
[%]
0.19
Average
Mass
[ppm]
1899
288
87
28.84
0.02
288015
165
870
40020
43.49
0.75
394103
7482
145
0.01
1
71
57
0.29
2719
264
79
26.41
263735
264078
1000000
2847
145
434994
7482
288390
165
Sum
[ppm]
1899
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
Test/Measurement
京公网安备 11010802033920号
EEWORLD
