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P0408FC3.3C-LF-T710-2

Description
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 8 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-8
CategoryDiscrete semiconductor    diode   
File Size121KB,6 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Environmental Compliance
Download Datasheet Parametric View All

P0408FC3.3C-LF-T710-2 Overview

Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 8 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-8

P0408FC3.3C-LF-T710-2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionR-PBGA-B8
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage4 V
ConfigurationCOMMON BIPOLAR TERMINAL, 8 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBGA-B8
JESD-609 codee1
Maximum non-repetitive peak reverse power dissipation250 W
Number of components8
Number of terminals8
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)270
polarityBIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage3.3 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
05156
P0408FC3.3C*
thru
Only One Name Means ProT
ek’Tion™
P0408FC36C*
FLIP CHIP ARRA
Y
APPLICA
TIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPA
TIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protects 4 to 7 Lines
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0408
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURA
TION
0408
(Single Chip Shown)
*U.S. Patent No. Des. “D456,367S”
05156.R5 4/05
1
www.protekdevices.com
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