KAI-11002
4008 (H) x 2672 (V) Interline
CCD Image Sensor
Description
The KAI−11002 Image Sensor is a high-performance 11-million
pixel sensor designed for professional digital still camera applications.
The 9.0
mm
square pixels with microlenses provide high sensitivity
and the large full well capacity results in high dynamic range. The two
high-speed outputs and binning capabilities allow for 1−3 frames per
second (fps) video rate for the progressively scanned images.
The vertical overflow drain structure provides anti-blooming
protection and enables electronic shuttering for precise exposure
control. Other features include low dark current, negligible lag and
low smear.
Table 1. GENERAL SPECIFICATIONS
Parameter
Architecture
Total Number of Pixels
Number of Effective Pixels
Number of Active Pixels
Number of Outputs
Pixel Size
Active Image Size
Typical Value
Interline CCD, Progressive Scan
4072 (H)
×
2720 (V) = 11.1 M
4033 (H)
×
2688 (V) = 10.8 M
4008 (H)
×
2672 (V) = 10.7 M
1 or 2
9.0
mm
(H)
×
9.0
mm
(V)
37.25 mm (H)
×
25.70 mm (V),
43.3 mm (Diagonal),
35 mm Optical Format
3:2
60,000 e
−
50%
32%, 34%, 40%
35%, 38%, 40%
13
mV/e
−
30 e
−
< 50 mV/s
7°C
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Figure 1. KAI−11002 Interline CCD
Image Sensor
Features
Aspect Ratio
Saturation Signal
Quantum Efficiency
KAI−11002−ABA
KAI−11002−CBA (RGB)
KAI−11002−FBA (RGB)
Output Sensitivity
Total Noise
Dark Current
Dark Current Doubling
Temperature
Dynamic Range
Charge Transfer Efficiency
Blooming Suppression
Smear
Image Lag
Maximum Data Rate
Package
Cover Glass
•
•
•
•
•
•
•
High Resolution
High Sensitivity
High Dynamic Range
Low Noise Architecture
High Frame Rate
Binning Capability for Higher Frame Rate
Electronic Shutter
Applications
•
Industrial Inspection
•
Aerial Photography
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
66 dB
> 0.99999
> 1000X
< −80 dB
< 10 e
−
28 MHz
40-pin, CERDIP, 0.070″ Pin Spacing
AR Coated or Clear Glass
NOTE: All Parameters are specified at T = 40°C unless otherwise noted.
©
Semiconductor Components Industries, LLC, 2016
1
February, 2016 − Rev. 5
Publication Order Number:
KAI−11002/D
KAI−11002
ORDERING INFORMATION
Table 2. ORDERING INFORMATION − KAI−11002 IMAGE SENSOR
Part Number
KAI−11002−AAA−CR−B1*
KAI−11002−AAA−CR−B2*
KAI−11002−AAA−CR−AE*
KAI−11002−AAA−CP−B1
KAI−11002−AAA−CP−B2
KAI−11002−AAA−CP−AE
KAI−11002−ABA−CD−BX
KAI−11002−ABA−CD−B0
KAI−11002−ABA−CD−B1
KAI−11002−ABA−CD−B2
KAI−11002−ABA−CD−AE
KAI−11002−ABA−CR−B1*
KAI−11002−ABA−CR−B2*
KAI−11002−ABA−CR−AE*
KAI−11002−ABA−CP−B1
KAI−11002−ABA−CP−B2
KAI−11002−ABA−CP−AE
KAI−11002−FBA−CD−B1
KAI−11002−FBA−CD−B2
KAI−11002−FBA−CD−AE
KAI−11002−CAA−CD−B1*
KAI−11002−CAA−CD−B2*
KAI−11002−CAA−CD−AE*
Description
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Grade 1
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Grade 2
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Engineering Sample
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Grade 1
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Grade 2
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Special Grade
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 0
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 1
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 2
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Boht Sides), Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Grade 1
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Grade 2
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass with AR Coating (2 Sides), Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Grade 1
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Grade 2
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass, Engineering Sample
Gen2 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 1
Gen2 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 2
Gen2 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Engineering Sample
Gen1 Color (Bayer RGB), No Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 1
Gen1 Color (Bayer RGB), No Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 2
Gen1 Color (Bayer RGB), No Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Engineering Sample
KAI−11002−CAA
Serial Number
KAI−11002−FBA
Serial Number
KAI−11002−ABA
Serial Number
Marking Code
KAI−11002−AAA
Serial Number
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2
KAI−11002
Table 2. ORDERING INFORMATION − KAI−11002 IMAGE SENSOR
(continued)
Part Number
KAI−11002−CBA−CD−B1*
KAI−11002−CBA−CD−B2*
KAI−11002−CBA−CD−AE*
Description
Gen1 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 1
Gen1 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Grade 2
Gen1 Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass with AR Coating (Both Sides), Engineering Sample
Marking Code
KAI−11002−CBA
Serial Number
*Not recommended for new designs.
Table 3. ORDERING INFORMATION − EVALUATION SUPPORT
Part Number
KAI−11002−12−30−A−EVK
Evaluation Board (Complete Kit)
Description
See the ON Semiconductor
Device Nomenclature
document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
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3
KAI−11002
DEVICE DESCRIPTION
Architecture
16 Dark Rows
8 Buffer Rows
B
G
G R
B
G
G R
12 Buffer Columns
13 Buffer Columns
20 Dark Columns
4008 (H) x 2672 (V)
Active Pixels
Pixel
1,1
B
G
G R
B
G
G R
4 Dummy Pixels
19 Dark Columns
8 Buffer Rows
17 Dark Rows
Fast Line Dump
Video L
Single
or
Dual
4
4
20
20
12
12
2004
4008
2004
13
13
19
19
4
4
4 Dummy Pixels
Video R
Figure 2. Block Diagram
There are 17 light shielded rows followed 2,688
photoactive rows and finally 16 more light shielded rows.
The first 8 and the last 8 photoactive rows are buffer rows
giving a total of 2,672 lines of image data.
In the single output mode all pixels are clocked out of the
Video L output in the lower left corner of the sensor. The first
4 empty pixels of each line do not receive charge from the
vertical shift register. The next 20 pixels receive charge from
the left light shielded edge followed by 4,033 photosensitive
pixels and finally 19 more light shielded pixels from the
right edge of the sensor. The first 12 and last 13
photosensitive pixels are buffer pixels giving a total of 4,008
pixels of image data.
In the dual output mode the clocking of the right half of the
horizontal CCD is reversed. The left half of the image is
clocked out Video L and the right half of the image is clocked
out Video R. For the Video L each row consists of 4 empty
pixels followed by 20 light shielded pixels followed by
2,016 photosensitive pixels. For the Video R each row
consists of 4 empty pixels followed by 19 light shielded
pixels followed by 2,017 photosensitive pixels. When
reconstructing the image, data from Video R will have to be
reversed in a line buffer and appended to the Video L data.
The dark rows are not entirely dark and so should not be
used for a dark reference level. Use the dark columns on the
left or right side of the image sensor as a dark reference.
Of the dark columns, the first and last dark columns
should not be used for determining the zero signal level.
Some light does leak into the first and last dark columns.
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4
KAI−11002
Pixel
Top View
Direction
of
Charge
Transfer
Transfer
Gate
n−
n−
V2
n
p Well (GND)
9.0
mm
n Substrate
True Two Phase Burried Channel VCCD
Lightshield over VCCD not shown
Cross Section Through
Photodiode and VCCD Phase 1
Light Shield
Photodiode
V1
p
p+
n
Cross Section Through Photodiode
and VCCD Phase 2 at Transfer Gate
Light Shield
Transfer
Gate
p
p
p+
n
V2
p
n
p
p
p
n Substrate
n Substrate
NOTE: Drawings not scale.
Cross Section Showing Lenslet
Lenslet
Red Color Filter
Light Shield
VCCD
Photodiode
Light Shield
VCCD
Figure 3. Pixel Architecture
An electronic representation of an image is formed when
incident photons falling on the sensor plane create
electron-hole pairs within the individual silicon
photodiodes. These photoelectrons are collected locally by
the formation of potential wells at each photosite. Below
photodiode saturation, the number of photoelectrons
collected at each pixel is linearly dependent upon light level
and exposure time and non-linearly dependent on
wavelength. When the photodiodes charge capacity is
reached, excess electrons are discharged into the substrate to
prevent blooming.
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5
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V1
Photodiode
Cross Section Down Through VCCD
V1
V2
V1
9.0
mm
Direction of
Charge
Transfer
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