HBL21000RP
Product Preview
1-Channel ESD Protector
Product Description
The HBL21000RP provides robust ESD protection for sensitive
parts that may be subjected to electrostatic discharge (ESD). The tiny
form factor and single wirebond requirement enables it to be used in
very confined spaces. The electrical ‘back−to−back zener’
configuration also provides ESD protection in cases where nodes with
AC signals are present. This device is designed and characterized to
safely dissipate ESD strikes of at least
±8
kV, according to the
MIL−STD−883 (Method 3015) specification for Human Body Model
(HBM) ESD.
Features
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•
Compact Die Protects from ESD Discharges
•
Almost No Conduction at Signal Amplitudes Less Than
±4
V
•
ESD Protection Over
±8
kV Contact Discharge per MIL_STD_883
International ESD Standard
Applications
•
LED Lighting
•
Modules
•
Interface Circuits
Aluminum (Al) Pad on the Topside
Gold−Tin (AuSn) on the Backside
Figure 1. Electrical Schematic
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 4
Publication Order Number:
HBL21000/D
HBL21000RP
CURRENT/VOLTAGE GRAPH
Symbol
I
CL+
V
CL+
I
L2+
V
L2+
I
L1+
V
L1+
I
CL−
V
CL−
I
L1−
V
L1−
NOTE:
Description
Positive Clamping Current
Positive Clamping Voltage
Leakage Current at V
L2+
Voltage Condition: +14V
Leakage Current at V
L1+
Voltage Condition: +4V
Negative Clamping Current
Negative Clamping Voltage
Leakage Current at V
L1−
Voltage Condition: −4V
The polarity in the above graph corresponds to the
polarity convention shown in the application diagram.
Figure 2.
ORDERING INFORMATION
Ordering Part Number
HBL21000RP
Topside Metal
Al
Backside Metal
AuSn
Thickness
4 mils
Shipping Method
Ring Pack
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature Range
Storage Temperature Range
Rating
−40 to +150
−65 to +150
Unit
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
STANDARD OPERATING CONDITIONS
Parameter
Rating
−40 to +150
Unit
°C
Operating Temperature Range
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2
HBL21000RP
ELECTRICAL OPERATING CHARACTERISTICS
(See Note 1)
Symbol
I
LEAK
Leakage Current
Parameter
Test Conditions
V =
±4
V, 150°C (Note 2)
V =
±4
V, 25°C (V
L1±
)
V = +14 V, 25°C (V
L2+
)
T
A
= 25°C;
at 10 mA (I
CL+
)
at −10 mA (I
CL−
)
T
A
= 25°C
(Note 2)
+16
−9.0
±8
+19
−7.0
Min
Typ
Max
4.0
0.3 (I
L1±
)
0.5 (I
L2+
)
+22
−5.0
Unit
mA
mA
mA
V
V
CL
Signal Clamp Voltage
Positive polarity on signal node (V
CL+
)
Negative polarity on signal node (V
CL−
)
ESD Protection − withstand voltage:
Human Body Model (MIL−STD−883, Method
3015)
V
ESD
kV
1. Operating characteristics are over standard operating conditions unless otherwise specified.
2. This parameter is guaranteed by design and/or characterization.
MECHANICAL DETAILS
MECHANICAL SPECIFICATIONS
Parameter
Composition
Die shape
Length (sawn)
Width (sawn)
Thickness
Top pad length
Top pad width
Top pad composition
Back metal (underside)
Condition
Silicon wafer,
p+ doped
Square
200
200
4
125
125
Al (Aluminum)
AuSn (Gold−Tin)
mm
mm
mils
mm
mm
Top Pad Opening:
125
mm
x 125
mm
Unit
Dimensions Diagram
Sawn Die Size:
200
mm
x 200
mm
Figure 3. Die Dimensions
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Phone:
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Email:
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USA/Canada
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Sales Representative
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HBL21000/D
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