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B5818WSRIG

Description
Rectifier Diode, Schottky, 1 Element, 1A, 30V V(RRM), Silicon,
CategoryDiscrete semiconductor    diode   
File Size266KB,4 Pages
ManufacturerTaiwan Semiconductor
Websitehttp://www.taiwansemi.com/
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B5818WSRIG Overview

Rectifier Diode, Schottky, 1 Element, 1A, 30V V(RRM), Silicon,

B5818WSRIG Parametric

Parameter NameAttribute value
MakerTaiwan Semiconductor
package instructionR-PDSO-G2
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeR-PDSO-G2
Number of components1
Number of terminals2
Maximum operating temperature125 °C
Maximum output current1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum power dissipation0.25 W
Maximum repetitive peak reverse voltage30 V
surface mountYES
technologySCHOTTKY
Terminal formGULL WING
Terminal locationDUAL

B5818WSRIG Preview

B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
Small Signal Product
1A, 20V - 40V Schottky Diode
FEATURES
- Low Forward Voltage Drop
- Surface mount device type
- Moisture sensitivity level (MSL): 3
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
MECHANICAL DATA
- Case: Bend lead SOD-323 package
- High temperature soldering guaranteed: 260°C/10s
- Weight: 4.3mg (approximately)
SOD-323
APPLICATION
- General purpose rectification application
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Non-Peak Repetitive Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Peak Forward Surge Current @t=8.3ms
Repetitive Peak Forward Current
Power Dissipation
Thermal Resistance form Junction to Ambient
Junction Temperature
Storage Temperature Range
PARAMETER
B5817WS
Reverse Breakdown Voltage
B5818WS
B5819WS
Reverse Voltage Leakage
Current
B5817WS
B5818WS
B5819WS
B5817WS
Forward Voltage
B5818WS
B5819WS
Diode Capacitance
at V
R
= 20 V
at V
R
= 30 V
at V
R
= 40 V
at I
F
= 1A
at I
F
= 3A
at I
F
= 1A
at I
F
= 3A
at I
F
= 1A
at I
F
= 3A
V
R
=4V, f=1.0MHz
C
D
V
F
I
R
at I
R
= 1 mA
V
(BR)
TEST CONDITION
SYMBOL
V
RM
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
I
FRM
P
D
R
THJA
T
J
T
STG
SYMBOL
MIN
20
30
40
-
-
-
-
-
-
-
-
-
-
0.45
0.75
0.55
0.875
0.6
0.9
120
V
V
V
pF
1
mA
VALUE
B5817WS
20
20
20
20
14
B5818WS
30
30
30
30
21
1
9
1.5
250
400
125
- 55 to + 125
MAX
-
-
-
V
B5819WS
40
40
40
40
28
UNIT
V
V
V
V
V
A
A
A
mW
°C/W
°C
°C
UNIT
Version: C1602
B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PACKING CODE
RI
PACKING CODE
SUFFIX
G
PACKAGE
SOD-323
PACKING
3K / 7" Reel
B581xWS
(Note)
Note : "x" is Device Code from "7" - "9".
EXAMPLE
EXAMPLE
PART NO.
B5817WS RQG
PART NO.
B5817WS
PACKING CODE
RQ
PACKING CODE
SUFFIX
G
DESCRIPTION
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
Fig. 1 Typical Forward Characteristics
10
Instantaneous Forward Current (A)
10
Fig. 2 Typical
Reverse Characteristics
Reverse current (mA)
1
T
A
=100°C
1
T
A
=100°C
0.1
0.1
T
A
=25°C
0.01
T
A
=25°C
0.01
0.0
0.4
Instantaneous Forward Voltage (V)
0.8
0.001
0.1
1
10
Reverse Voltage (V)
100
Fig. 3
Typical Capacitance vs. VR
250
200
150
100
50
0
Power dissipation (W)
300
250
Fig. 4 Power Derating Curve
Capacitance (pF)
200
150
100
50
0
0
5
10
Reverse Voltage (V)
15
20
0
25
50
75
100
125
150
Ambient Temperature (
°
C)
Version: C1602
B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
Small Signal Product
PACKAGE OUTLINE DIMENSIONS
SOD-323
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
1.15
2.30
0.25
1.60
0.80
Max
1.40
2.70
0.45
1.80
1.00
Unit (inch)
Min
0.045
0.091
0.010
0.063
0.031
Max
0.055
0.106
0.018
0.071
0.039
0.05
0.17
0.475 REF
-
0.10
0.002
0.007
0.19 REF
-
0.004
SUGGESTED PAD LAYOUT
DIM.
A
B
C
D
Unit (mm)
Typ.
0.63
0.83
1.60
2.86
Unit (inch)
Typ.
0.025
0.033
0.063
0.113
Version: C1602
B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
Small Signal Product
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: C1602

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