Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4206-4G
MA001283988
PG-DSO-14-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.173
0.015
0.060
1.207
49.007
0.277
0.172
7.927
78.068
1.226
1.030
0.184
0.652
Average
Mass
[%]
2.22
0.01
0.04
0.84
34.27
0.19
0.12
5.54
54.60
0.86
0.72
0.13
0.46
2. October 2014
143.00 mg
Sum
[%]
2.22
Average
Mass
[ppm]
22191
106
422
8440
35.16
0.19
342710
1937
1205
55437
60.26
0.86
0.72
545935
8575
7201
1285
0.59
4556
5841
1000000
602577
8575
7201
351678
1937
Sum
[ppm]
22191
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com