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MPC8272ZQM

Description
32-BIT, EPROM, 266MHz, RISC MICROCONTROLLER, PBGA516, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size395KB,61 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8272ZQM Overview

32-BIT, EPROM, 266MHz, RISC MICROCONTROLLER, PBGA516, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516

MPC8272ZQM Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionBGA,
Contacts516
Reach Compliance Codeunknown
ECCN code3A001.A.3
Has ADCNO
Address bus width30
bit size32
maximum clock frequency400 MHz
DAC channelYES
DMA channelYES
External data bus width64
JESD-30 codeS-PBGA-B516
length27 mm
Number of I/O lines57
Number of terminals516
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
ROM programmabilityEPROM
Maximum seat height2.55 mm
speed266 MHz
Maximum supply voltage5.75 V
Minimum supply voltage1.425 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Freescale Semiconductor
Technical Data
Document Number: MPC8272EC
Rev. 3, 09/2011
MPC8272
PowerQUICC II Family
Hardware Specifications
This document contains detailed information about power
considerations, DC/AC electrical characteristics, and AC
timing specifications for .13µm (HiP7) members of the
PowerQUICC II family of integrated communications
processors—the MPC8272, the MPC8248, the MPC8271,
and the MPC8247. They include on a single chip a 32-bit
Power Architecture® core that incorporates memory
management units (MMUs) and instruction and data caches
and that implements the Power Architecture instruction set;
a modified communications processor module (CPM); and
an integrated security engine (SEC) for encryption (the
MPC8272 and the MPC8248 only).
All four devices are collectively referred to throughout this
hardware specification as “the MPC8272” unless otherwise
noted.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 9
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 14
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 18
Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 27
Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 56
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 58
Document Revision History . . . . . . . . . . . . . . . . . . . 58
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© 2011 Freescale Semiconductor, Inc. All rights reserved.
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