AM29LV200BB90WAF datasheet, PDF

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AM29LV200BB90WAF: DescriptionFlash, 128KX16, 90ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48; Categorystorage storage; File Size1MB，46 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV200BB90WAF Overview

Flash, 128KX16, 90ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29LV200BB90WAF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	90 ns
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Data polling	YES
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8.15 mm
memory density	2097152 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,3
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
width	6.15 mm

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Am29LV200B

Data Sheet

(Retired Product)

Am29LV200B Cover Sheet

This product has been retired and is not recommended for designs. Please contact a Spansion representative for alternates.

Availability of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been

made are the result of normal data sheet improvement and are noted in the document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21521

Revision

Amendment

Issue Date

February 24, 2009

DATA SHEET

TABLE OF CONTENTS

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Special Handling Instructions ................................................... 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 1. Am29LV200B Device Bus Operations ................................ 9

DQ2: Toggle Bit II ................................................................... 21

Reading Toggle Bits DQ6/DQ2 ............................................... 21

DQ5: Exceeded Timing Limits ................................................ 22

DQ3: Sector Erase Timer ....................................................... 22

Figure 6. Toggle Bit Algorithm ........................................................ 22

Table 6. Write Operation Status..................................................... 23

Word/Byte Configuration .......................................................... 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences .............................. 9

Program and Erase Operation Status .................................... 10

Standby Mode ........................................................................ 10

Automatic Sleep Mode ................................................................10

RESET#: Hardware Reset Pin ...................................................10

Output Disable Mode .............................................................. 11

Table 2. Am29LV200BT Top Boot Block Sector Address Table..... 11

Table 3. Am29LV200BB Bottom Boot Block Sector Address Table 11

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 24

Extended (E) Devices ............................................................. 24

Supply Voltages .............................................................. 24

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic

Sleep Currents) .............................................................................. 26

Figure 10. Typical I

CC1

vs. Frequency ........................................... 26

Figure 11. Test Setup ..................................................................... 27

Table 7. Test Specifications ........................................................... 27

Autoselect Mode ..................................................................... 11

Table 4. Am29LV200B Autoselect Codes (High Voltage Method).. 12

Key to Switching Waveforms. . . . . . . . . . . . . . . . 27

Figure 12. Input Waveforms and Measurement Levels ................. 27

Sector Protection/Unprotection ............................................... 12

Temporary Sector Unprotect .................................................. 12

Figure 1. In-System Sector Protect/Unprotect Algorithms ...............13

Figure 2. Temporary Sector Unprotect Operation ...........................14

Read Operations .................................................................... 28

Figure 13. Read Operations Timings ............................................. 28

Hardware Reset (RESET#) .................................................... 29

Figure 14. RESET# Timings .......................................................... 29

Hardware Data Protection ...................................................... 14

Low V

Write Inhibit .............................................................. 14

Write Pulse “Glitch” Protection ............................................... 14

Logical Inhibit .......................................................................... 14

Power-Up Write Inhibit ............................................................ 14

Reading Array Data ................................................................ 15

Reset Command ..................................................................... 15

Autoselect Command Sequence ............................................ 15

Word/Byte Program Command Sequence ............................. 15

Unlock Bypass Command Sequence ..................................... 16

Figure 3. Program Operation ..........................................................16

Word/Byte Configuration (BYTE#) ........................................ 30

Figure 15. BYTE# Timings for Read Operations ............................ 30

Figure 16. BYTE# Timings for Write Operations ............................ 30

Erase/Program Operations ..................................................... 31

Figure 17. Program Operation Timings .......................................... 32

Figure 18. Chip/Sector Erase Operation Timings .......................... 33

Figure 19. Data# Polling Timings (During Embedded Algorithms) . 34

Figure 20. Toggle Bit Timings (During Embedded Algorithms) ...... 34

Figure 21. DQ2 vs. DQ6 ................................................................. 35

Temporary Sector Unprotect .................................................. 35

Figure 22. Temporary Sector Unprotect Timing Diagram .............. 35

Figure 23. Sector Protect/Unprotect Timing Diagram .................... 36

Chip Erase Command Sequence ........................................... 16

Sector Erase Command Sequence ........................................ 17

Erase Suspend/Erase Resume Commands ........................... 17

Figure 4. Erase Operation ...............................................................18

Alternate CE# Controlled Erase/Program Operations ............ 37

Figure 24. Alternate CE# Controlled Write Operation Timings ...... 38

Command Definitions ............................................................. 19

Table 5. Am29LV200B Command Definitions................................. 19

DQ7: Data# Polling ................................................................. 20

Figure 5. Data# Polling Algorithm ...................................................20

RY/BY#: Ready/Busy# ........................................................... 21

DQ6: Toggle Bit I .................................................................... 21

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 39

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 39

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

TS 048—48-Pin Standard TSOP ............................................ 40

SO 044—44-Pin Small Outline Package ................................ 41

FBA048—48-Ball Fine-Pitch Ball Grid Array, 0.80 mm pitch,

6 x 8 mm package .................................................................. 42

February 24, 2009 21521D7

Am29LV200B

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