Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS5180-2EKA
MA001328362
PG-DSO-14-40
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.130
0.017
0.070
1.392
56.512
0.393
0.170
7.842
77.229
1.226
1.417
0.128
0.605
Average
Mass
[%]
1.43
0.01
0.05
0.93
37.89
0.26
0.11
5.26
51.79
0.82
0.95
0.09
0.41
30. January 2015
149.13 mg
Sum
[%]
1.43
Average
Mass
[ppm]
14282
117
467
9332
38.88
0.26
378938
2635
1143
52586
57.16
0.82
0.95
517854
8222
9505
861
0.50
4058
4919
1000000
571583
8222
9505
388854
2635
Sum
[ppm]
14282
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
EEWORLD
