AM27X256-70JC datasheet, PDF - EEWORLD Datasheet

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AM27X256-70JC: Description256 Kilobit (32 K x 8-Bit) CMOS ExpressROM Device; Categorystorage storage; File Size67KB，10 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27X256-70JC Overview

256 Kilobit (32 K x 8-Bit) CMOS ExpressROM Device

AM27X256-70JC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	QFJ
package instruction	QCCJ, LDCC32,.5X.6
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	70 ns
Other features	EXPRESS
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
memory density	262144 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0001 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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FINAL

Am27X256

256 Kilobit (32 K x 8-Bit) CMOS ExpressROM Device

DISTINCTIVE CHARACTERISTICS

As an OTP EPROM alternative:

— Factory optimized programming

— Fully tested and guaranteed

As a Mask ROM alternative:

— Shorter leadtime

— Lower volume per code

Fast access time

— 55 ns

Single +5 V power supply

Compatible with JEDEC-approved EPROM

pinout

±10%

power supply tolerance

High noise immunity

Low power dissipation

— 20 µA maximum CMOS standby current

Available in Plastic Dual-In-line Package (PDIP)

and Plastic Leaded Chip Carrier (PLCC)

Latch-up protected to 100 mA from –1 V to

+ 1 V

Versatile features for simple interfacing

— Both CMOS and TTL input/output compatibility

— Two line control functions

GENERAL DESCRIPTION

The Am27X256 is a factory programmed and tested

OTP EPROM. It is programmed after packaging prior to

final test. Every device is rigorously tested under AC

and DC operating conditions to your stable code. It is

organized as 32 Kwords by 8 bits per word and is avail-

able in plastic dual in-line packages (PDIP), as well as

plastic leaded chip carrier (PLCC) packages. Express-

ROM devices provide a board-ready memory solution

for medium to high volume codes with short leadtimes.

This offers manufacturers a cost-effective and flexible

alternative to OTP EPROMs and mask programmed

ROMs.

Data can be accessed as fast as 55 ns, allowing

high-performance microprocessors to operate with re-

duced WAIT states. The device offers separate Output

Enable (OE#) and Chip Enable (CE#) controls, thus

eliminating bus contention in a multiple bus micropro-

cessor system.

AMD’s CMOS process technology provides high

speed, low power, and high noise immunity. Typical

power consumption is only 80 mW in active mode, and

100 µW in standby mode.

BLOCK DIAGRAM

OE#

CE#

Output Enable

Chip Enable

and

Prog Logic

Decoder

A0–A14

Address

Inputs

Output

Buffers

Data Outputs DQ0–DQ7

Gating

Decoder

262,144

Bit Cell

Matrix

12082F-1

Publication#

12082

Rev:

Amendment/0

Issue Date:

May 1998

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