Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ060NE2LS
MA001015336
PG-TSDSON-8-25
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.182
0.002
0.010
0.197
7.988
0.030
0.038
1.977
17.176
0.400
0.020
0.008
0.006
0.307
0.001
0.005
0.094
3.816
0.001
0.004
0.073
2.959
Average
Mass
[%]
0.52
0.01
0.03
0.56
22.63
0.09
0.11
5.60
48.66
1.13
0.06
0.02
0.02
0.87
0.00
0.01
0.27
10.81
0.00
0.01
0.21
8.38
14. August 2015
35.30 mg
Sum
[%]
0.52
Average
Mass
[ppm]
5156
70
279
5574
23.23
0.09
226334
856
1087
56004
54.37
1.13
0.06
486634
11339
576
228
182
0.91
8701
33
133
2663
11.09
108116
26
103
2065
8.60
83841
86035
1000000
110945
9111
543725
11339
576
232257
856
Sum
[ppm]
5156
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
DIY/Open Source Hardware
京公网安备 11010802033920号
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