The ECP203 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +48
dBm OIP3 and +32.5 dBm of compressed 1dB power. It
is housed in an industry standard SOIC-8 or 16-pin
4x4mm QFN SMT package. All devices are 100% RF
and DC tested.
The ECP203 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP203 to maintain high linearity over temperature and
operate directly off a single +5V supply.
This
combination makes the device an excellent candidate for
driver amplifier stages in wireless-LAN, digital
multimedia broadcast, or fixed wireless applications. The
device can also be used in next generation RFID readers.
Functional Diagram
Vbias
N/C
14
16
Vref 1
N/C 2
RF IN 3
N/C 4
5
N/C
6
N/C
7
N/C
8
N/C
N/C
15
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
x
10 dB Gain @ 2450 MHz
x
9 dB Gain @ 2600 MHz
x
Single Positive Supply (+5V)
x
Available in SOIC-8 or 16pin
4mm QFN package
ECP203D
Vref 1
N/C 2
RF IN 3
N/C 4
8
7
6
5
Vbias
Applications
x
x
x
x
W-LAN
RFID
DMB
Fixed Wireless
RF OUT
RF OUT
N/C
ECP203G
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Operating Current Range, Icc
(3)
Device Voltage, Vcc
Units Min
MHz
MHz
dB
dB
dB
dBm
dBm
dB
MHz
dB
dBm
dBm
mA
V
2300
Typ
2450
10
20
6.8
+32.5
+48
7.7
2600
9
+32
+47
800
+5
Max
2700
700
900
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V in tuned application circuit.
2. 3OIP measured with two tones at an output power of +17 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 200 mA at P1dB. Pin 1 is used as
a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 22mA of current when used with a series bias resistor of R1=15 . (ie. total device current typically will be 822 mA.)
¡
Absolute Maximum Rating
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Ordering Information
ECP203D
ECP203G
ECP203D-PCB2450
ECP203D-PCB2650
ECP203G-PCB2450
ECP203G-PCB2650
Parameters
-40 to +85
qC
-65 to +150
qC
+28 dBm
+8 V
1400 mA
8W
Rating
Part No.
2 Watt InGaP HBT Amplifier (16p 4mm Pkg)
2 Watt InGaP HBT Amplifier (Soic-8 Pkg)
2450 MHz Evaluation Board
2600 MHz Evaluation Board
2450 MHz Evaluation Board
2600 MHz Evaluation Board
Description
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
OCtober 2004
2 Watt, High Linearity InGaP HBT Amplifier
ECP203
The Communications Edge
TM
Product Information
ECP203G (SOIC-8 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP203G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
¢
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
1
8
7
6
5
2
3
Land Pattern
4
Function
Vref
Input
Output
Vbias
GND
N/C or GND
Pin No.
1
3
6, 7
8
Backside Padd
2, 4, 5
Mounting Config. Notes
1.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
¢
2.
-40 to +85q C
17.5q C / W
155q C
MTTF (million hrs)
Rating
100000
MTTF vs. GND Tab Temperature
3.
4.
5.
10000
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
800 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
¢
¢
1000
6.
7.
8
100
60
70
80
90
100 110
Tab Temperature (°
C)
120
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25
mm (.010” ).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
OCtober 2004
2 Watt, High Linearity InGaP HBT Amplifier
ECP203
The Communications Edge
TM
Product Information
ECP203D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ ECP203D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
¢
Land Pattern
Vbias
N/C
14
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
TYP.
4.00mm
Vref 1
N/C 2
RF IN 3
N/C 4
16
N/C
15
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
8
N/C
0.65mm
TYP.
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Diagram
5
N/C
6
N/C
7
N/C
16L 4.0mm X 4.0mm PACKAGE
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
¢
-40 to +85q C
17.5q C / W
155q C
MTTF (million hrs)
Rating
100000
MTTF vs. GND Tab Temperature
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
10000
Mounting Config. Notes
1.
2.
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25
mm (.010” ).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
800 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
¢
¢
1000
100
60
70
80
90
100 110
Tab Temperature (°
C)
120
3.
4.
5.
6.
7.
8
Specifications and information are subject to change without notice
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Embedded System
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