TDM3021
Random Phase Switching
400V
Triac Driver
Description
The TDM3021 consists of a GaAs LED optically coupled to
a Random Phase photo-sensitive Triac Driver chip. The
miniature 4 pin SOP package provides high input-to-output
isolation and drives high powered triacs while using very
little board space. Typical uses include interfacing logic
level control signals to equipment powered from 110V
AC
lines.
The TDM3021 comes standard in a miniature 4 pin SOP
package.
Features
Ultra Miniature 4-Pin Small Outline Package
Random Phase Switching
400V Blocking Voltage
Low Trigger Current (15mA MAX)
High Input-to-Output Isolation (3.75kV
RMS
)
Long Life / High Reliability
RoHS / Pb-Free / REACH Compliant
Agency Approvals
Applications
Home Appliances
Motor / Drive Controls
Solid State Relays
High Power Triacs
Dimmer Controls
UL / C-UL:
VDE:
File # E201932
File # 40035191 (EN 60747-5-2)
Absolute Maximum Ratings
The values indicated are absolute stress ratings. Functional
operation of the device is not implied at these or any
conditions in excess of those defined in electrical
characteristics section of this document. Exposure to
absolute Maximum Ratings may cause permanent damage
to the device and may adversely affect reliability.
Storage Temperature …………………………..-55 to +125°C
Operating Temperature …….………...………-40 to +100°C
Continuous Input Current ………………………………..50mA
Transient Input Current ………………….……………..500mA
Reverse Input Control Voltage …………..…………………5V
Input Power Dissipation …………………………………70mW
Total Power Dissipation ……………………………..170mW
Solder Temperature – Wave (10sec)……………….….260°C
Solder Temperature – IR Reflow (10sec)….…………..260°C
Schematic Diagram
(+) Input
1
4
(+/- Load)
(-) Input
2
Random
Phase
Circuit
Ordering Information
3
(-/+) Load
Part Number
TDM3021
TDM3021-TR
Description
4 pin SOP, (100/Tube)
4 pin SOP, Tape and Reel (2000/Reel)
TDM3021
NOTES: Suffixes listed above are not included in marking on
device for part number identification
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 1 of 8
TDM3021 /TR
Rev 2.00 (11/12/2013)
001683
TDM3021
Random Phase Switching
400V
Triac Driver
Electrical Characteristics,
T
A
= 25°C (unless otherwise specified)
Parameter
Input Specifications
LED Forward Voltage
LED Reverse Voltage
Reverse Leakage Current
Trigger Current
1
Symbol
V
F
BV
R
I
InRleak
I
FT
Min.
-
5
-
-
Typ.
1.4
-
-
-
Max.
1.8
-
10
15
Units
V
V
A
mA
Test Conditions
I
F
= 10mA
I
R
= 10μA
V
R
= 5μA
Main Terminal Voltage = 3V
Output Specifications
Blocking Voltage
Peak Blocking Current
Continuous Load Current
On-State Voltage
Leakage Current
Holding Current
Critical Rate of Rise
2
V
DRM
I
DRM1
I
O
V
ON
I
DRM2
I
HOLD
dV/dt
400
-
-
-
-
-
1,000
-
10
-
2
0.2
250
1,500
-
100
70
3
1
-
-
V
nA
mA
V
A
A
V/S
I
O
= 1A
V
DRM
= 400
I
F
= 15mA
I
F
= 15mA, I
TM
= 70mA
I
F
=0mA, V
DRM
= 400V
-
-
Isolation Specifications
Isolation Voltage
Input-Output Resistance
Note 1:
Note 2:
V
ISO
R
I-O
3,750
-
-
10
12
-
-
V
RMS
RH
≤
50%, t=1min
V
I-O
= 500V
DC
Resistive load. For inductive loads, higher drive current is recommended
This is for static dV/dt. Test Circuit Below
TDM3021 Static dV/dt Test Circuit:
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 2 of 8
TDM3021 /TR
Rev 2.00 (11/12/2013)
001683
TDM3021
Random Phase Switching
400V
Triac Driver
TDM3021 Performance & Characteristics Plots,
T
A
= 25°C (unless otherwise specified)
Figure 1:
Maximum Load Current vs. Temperature
Figure 2:
Typical Blocking Voltage Distribution
(N=100, Ambient Temperature = 25°C)
Figure 3:
On State Characteristics
Figure 4:
Peak Blocking Current (I
DRM1
) vs. Temperature (°C)
Figure 5:
Trigger Current (
I
FT
) vs. Temperature (°C)
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 3 of 8
TDM3021 /TR
Rev 2.00 (11/12/2013)
001683
TDM3021
Random Phase Switching
400V
Triac Driver
TDM3021 Solder Reflow Temperature Profile Recommendations
(1)
Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Process
Step
A
B
C
D
E
F
G
H
Description
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
Parameter
(2)
Wave Solder:
Maximum Temperature:
Maximum Time:
Pre-heating:
Single Occurrence
260ºC (at terminal)
10s
100 - 150ºC (30 - 90s)
(3)
Hand Solder:
Maximum Temperature:
Maximum Time:
Single Occurrence
350ºC
3s
(at tip of soldering iron)
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 4 of 8
TDM3021 /TR
Rev 2.00 (11/12/2013)
001683
Sensor
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