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WEDF1M32B-90G2UI5

Description
Flash Module, 1MX32, 90ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size757KB,9 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WEDF1M32B-90G2UI5 Overview

Flash Module, 1MX32, 90ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68

WEDF1M32B-90G2UI5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instruction0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
Contacts68
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time90 ns
Other featuresUSER CONFIGURABLE AS 4M X 8
Spare memory width16
startup blockBOTTOM
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
typeNOR TYPE
width22.36 mm
WEDF1M32B-XXX5
ADVANCED*
1Mx32 5V NOR FLASH MODULE
FEATURES

Access Times of 70, 90, 120ns

Packaging:
• 66 pin, PGA Type, 1.075” square, Hermetic Ceramic HIP
(Package 400)
• 68 lead, 22mm Low Profile CQFP, 3.5mm (0.140”),
(Package 510)

Sector Architecture
• One 16KByte Sectors
• Two 8KByte Sectors
• One 32KByte Sectors
• Fifteen 64KByte Sectors

1,000,000 Erase/Program Cycles

Organized as 1Mx32, user configurable as 2Mx16 or 4Mx8.

Commercial, Industrial and Military Temperature Ranges

5V ± 10% for Read and Write Operations.

Low Power CMOS

Embedded Erase and Program Algorithm

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight
WEDF1M32B-XG2UX5 - 8 grams typical
WEDF1M32B-XH1X5 - 13 grams typical
* This product is under development, is not qualified or characterized and is subject to change or
cancellation without notice.
PIN CONFIGURATION FOR WF1M32B-XH1X5
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
RESET#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
A
19
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
NC
I/O
27
A
4
A
5
A
6
NC
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
66
1M x 8
PIN DESCRIPTION
I/O0-31
56
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Selects
Output Enable
Reset
Power Supply
Ground
Not Connected
A0-19
WE#
CS1-4#
OE#
RESET#
V
CC
GND
NC
Block Diagram
CS1#
RESET#
WE#
OE#
A0-19
1M x 8
1M x 8
1M x 8
CS2#
CS3#
CS4#
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2011
Rev. 4
© 2011 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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