rev.1.0 05.05.15
UVMAX335-15
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Deep Ultraviolet Light Emission Source
335 nm, 10-15 mW
Multi chip LED array
Thermistor
TEC (optionally)
TO3 metal can with SiO
2
glass lens
UV Curing, Optical Sensing
Description
UVMAX335
is a series of
AlGaN
based deep UV multi chip LED arrays, utilizing up to 4 parallel strings (common cathode) carrying
up to 9 pcs of parallel connected chip dies each.
UVMAX335
features total optical output power of
10-15 mW
at a nominal current
draw of 360mA, and typical emission wavelength of
340 nm.
It comes in hermetically sealed TO3 metal can package in
hemispherical lens or flat glass window configuration, with
integrated thermistor. UVMAX335
is widely used for UV curing, optical
sensing, and imaging of dyes, inks and markers.
UVMAX335
can optionally be equipped with an
integrated thermo electric
cooler.
Maximum Rating
(T
Parameter
Power Dissipation, DC
*
Forward Current
(T
A
=25°C)
Operating Temperature
Storage Temperature
Soldering Temperature (max 5s)
CASE
= 25°C)
Symbol
P
D
I
F
T
OPR
T
STG
T
SOL
- 30
- 30
Values
Min.
Max.
4.3
720
+ 55
+ 100
+ 190
Unit
W
mA
°C
°C
°C
*
Maximum dissipated power must not exceed 200mW without thermal management
Electro-Optical Characteristics
(T
Parameter
Peak Wavelength
Forward Voltage
Radiated Power
*1
CASE
=
25°C, I
F
= 360 mA)
Unit
nm
nm
V
mW
deg.
deg.
Symbol
λ
P
∆λ
V
F
PO
2Ө
1/2
2Ө
1/2
Values
Min.
Typ.
335
340
12
4.0
10
35
120
5.0
Max.
345
15
6.0
15
Spectral Width (FWHM)
*2
*3
Beam Angle (hemispherical lens)
Beam Angle (flat window)
* wavelength measurement tolerance: ± 2 nm
* forward voltage measurement tolerance: ± 2 %
3
* output power measurement tolerance: ± 10 %
2
1
NOTE: UVMAX LEDs are accompanied by a test report, overriding the electrical characteristics given in this datasheet
www.roithner-laser.com
1
Precautions
Soldering:
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Do avoid overheating of the LED
Do avoid electrostatic discharge (ESD)
Do avoid mechanical stress, shock, and vibration
Do only use non-corrosive flux.
Do only solder the leads. Soldering of header or cap will damage the LED
Do only cut the leads at room temperature with an ESD protected tool
Do not solder closer than 3 mm from base of the header
Do form leads prior to soldering
Do not impose mechanical stress on the header when forming the leads
Do not apply current to the LED until it has cooled down to room temperature after soldering
Recommended soldering conditions:
dip soldering
pre-heat time
dipping time
solder bath temperature
max 30 s
max 5 s
max 190 °C
soldering time
solder temperature
hand soldering
max 5 s
max 190 °C
It is strongly advised to perform soldering at the shortest time and lowest temperature
possible.
Cleaning:
Cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended
DO NOT USE acetone, chloroseen, trichloroethylene, or MKS
DO NOT USE ultrasonic cleaners
Static Electricity:
LEDs are sensitive to electrostatic discharge (ESD).
Precautions against ESD must be taken when handling or
operating these LEDs. Surge voltage or electrostatic discharge can result in complete failure of the device.
UV-Radiation:
During operation these LEDs do emit
high intensity ultraviolet light,
which is hazardous to skin and eyes, and may
cause cancer. Do avoid exposure to the emitted UV light.
Protective glasses are recommended.
It is further advised
to attach a warning label on products/systems that do utilize UV-LEDs:
Class 1
Operation:
Do
only
operate UVMAX LEDs with a current source.
Running these LEDs from a voltage source
will
result in complete failure of the device.
Current of a LED is an exponential function of the voltage across it. Usage of current regulated drive circuits is
mandatory
© All Rights Reserved
The above specifications are for reference purpose only and subjected to change without prior notice
www.roithner-laser.com
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Analogue and Mixed Signal
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