UVLED365-SMD
TECHNICAL DATA
365 nm SMD UVLED
Features
•
•
•
•
Zener diode is built in the protective circuit against static electricity
Low Voltage DC Operated
High Power Intensity
Complies with RoHS Directive
Specifications (25°C)
Type
Absolute Maximum Ratings
DC Forward Current
Peak Pulse Forward Current *
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature (reflow, 10 s)
Soldering Temperature (hand, 3 s)
* Note: 1/10 duty cycle, <10 ms pulse width
Symbol
I
F
I
FP
I
R
P
D
T
OP
T
STG
T
SOL
T
SOL
Value
25
80
85
100
-30 … +85
-40 … +100
260
350
Unit
mA
mA
mA
mW
°C
°C
°C
°C
Characteristics
Electrical Specification
Forward Current
Forward Voltage *
1
Optical Specification
CW Output Power *
2
Symbol
I
F
V
F
Rank 4
Rank 5
Rank 6
P
O
P
O
P
O
λ
P
λ
φ
Min.
-
-
1700
2400
3400
360
Typ.
20
3.6
-
-
-
365
15
100
Max.
-
4.0
2400
3400
4800
370
Unit
mA
V
mW
mW
mW
nm
nm
deg.
Peak Wavelength *
3
Spectrum Half Width
Viewing Angel
* Note:
1. Forward voltage measurement tolerance is ± 0.2 V
2. Optical ouput measurement tolerance is ± 10%
3. Peak wavelength measurement tolerance is ± 3 nm
Device Materials
Item
Package
Encapsulating Resin
Electrodes
Ceramics
Silicone Resin
Au Plating
Material
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Typical Performance Curves
Forward Voltage vs Forward Current:
Forward Voltage vs relative Output Power :
Duty Ratio vs Allowable Forward Current:
Ambient Temperature vs. Forward Voltage:
Ambient Temp. vs. Relative Output Power:
Ambient Temp. vs Allowable Forward Current:
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Forward Current vs. Peak Wavelenght.
Spectrum:
Ambient Temperature vs. Peak Wavelenght:
Directivity:
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Reliability
1. Test items and result
No.
1
2
3
4
5
6
7
8
9
10
11
12
Test Item
Steady State
Operating Life
High Temp. Steady
State Operating Life
High Temp. High
Humidity Steady
State
Low Temp. Steady
State Operating Life
Reflow Soldering
Reflow Solderability
Themal Shock
Temperature Cycle
Moisture
Resistance Cycle
High Temperature
Storage
Low Temperature
Storage
Vibration
JEITA ED-4701
330 301
JEITA ED-4701
330 303
JEITA ED-4701
330 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
200 202
JEITA ED-4701
400 403
Standard Test
Methode
Test Conditions
I
F
=25mA, Ta=25°C
I
F
=7.5mA, Ta=85°C
Ta=60°C, RH=90%, I
F
=20mA
I
F
=20mA, Ta=-30°C
Tsol=260 ± 5°C, 10sec
Tsol=215 ± 5°C, 3sec
0°C … +100°C (15 s)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1 cycle
Ta=100°C
Ta=-40°C
100 ~ 2k ~ 100HZ sweep 4min.
200m/s², 3directions, 4 cycles
Note
1000 Hr
1000 Hr
500 Hr
1000 Hr
2 Times
1 Time
>95%
20
cycles
100
cycles
10
cycles
1000 Hr
1000 Hr
48min
Sample
s
50
50
50
50
50
50
50
50
50
50
50
50
Passed
50/50
50/50
50/50
50/50
50/50
50/50
50/50
50/50
50/50
50/50
50/50
50/50
2. Criteria for judging the damage
Item
Forward Voltage
Optical Power Ouput
* Note:
1. U.S.L: Upper Standard Level
2. L.S.L: Lower Standard Level
Symbol
V
F
P
O
Test Conditions
I
F
=20mA
I
F
=20mA
Criteria for Judgment
Min.
Max.
-
U.S.L x 1.1
L.S.L x 0.7
-
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Precaution for Use
1. Cautions
•
This device is a UV LED, which radiates intense UV light during operation.
•
DO NOT look directly into the UV light or look through the optical system. To prevent
inadequate exposure of UV radiation, wearing UV protective glasses is recommended
2. Moisture Proof Package
•
When moisture is absorbed into the SMD package, it may vaporize and expand during
soldering. This can cause exfoliation of the contacts, alter the optical characteristics of the
LED, and may irreversible damage the LED.
3. Soldering
•
The LEDs should be sodered using the reflow soldering method. Function of the LEDs can
not be guaranteed after assembling was done using dip soldering method
•
Recommended soldering conditions:
Reflow Soldering
Lead Solder
Lead-free Solder
120 …150°C
180 …200°C
max 120 s
max 120 s
240°C
260°C
max 10 s
max 10 s
Please see graph below
Please see graph below
Lead free Solder:
Dip Soldering
-
-
max 350°C.
max 3 s
-
Pre-Heat
Pre-Heat Time
Peak Temperature
Soldering time
Condition
Lead Solder:
Recommended Solder Pad design (unit mm):
•
•
•
Soldering at the lowest possible temperatures is desireable for the LEDs.
Occasionally there is a decrease in LEDs brightness due to the influence of heat or ambient
atmoshere during soldering. Nitrogen reflow soldering is recommended therefor.
LEDs encapsulation material is silicone. Therefor the LEDs surface is soft and must not be
exposed to strong pressure during soldering.
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FPGA/CPLD
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