Reliability
1. Test items and result
Test Item
Resostance to Soldering
Heat
Solderability
Standard Test
Methode
JEITA ED-4701
300 302
JEITA ED-4701
303 303A
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
400 401
JEITA ED-4701
400 401
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260 ± 5°C, 10sec
3mm from the base of the lead
Tsld=245 ± 5°C, 5sec
using flux
Lead-free Solder (Sn-3.0Ag-0.5CU)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1 cycle
Load 5N (0.5kgf)
0°C ~ 90°C ~ 0°C bend 2 times
Load 10N (1kgf)
10 ± 1 sec.
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
I
F
=25mA, Ta=25°C
I
F
=15mA, 60°C, RH=90%
I
F
=20mA, Ta=-30°C
Note
1 time
1 time
over 95%
100 cycles
10 cycles
No
noticeable
damage
No
noticeable
damage
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
Number of
Damaged
0/50
0/50
Temperature Cycle
Moisture Resistance
Cyclic
Terminal Strength
(bending test)
Terminal Strength
(pull test)
High Temperature
Storage
Temperature Humidity
Storage
Low Temperature
Storage
Steady State Operating
Life
Steady State Operating
Life of High Humidity
Heat
Steady State Operating
Life of Low Temperature
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
500 hrs.
0/50
1000 hrs.
0/50
2. Criteria for judging the damage
Item
Forward Voltage
Optical Power Ouput
* Note:
1. U.S.L: Upper Standard Level
2. L.S.L: Lower Standard Level
Symbol
V
F
P
O
Test Conditions
I
F
=20mA
I
F
=20mA
Criteria for Judgment
Min.
Max.
-
U.S.L x 1.1
L.S.L x 0.7
-
23.08.2011
UVLED370-110E
4 of 6
Precaution for Use
1. Cautions
•
This device is a UV LED, which radiates intense UV light during operation.
•
DO NOT look directly into the UV light or look through the optical system. To prevent
inadequate exposure of UV radiation, wearing UV protective glasses is recommended
2. Lead Forming
•
When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
•
Lead forming should be done before soldering.
•
DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
•
When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
3. Soldering Conditions
•
Solder the LEDs no closer than 3 mm from the base of the lead.
•
Recommended soldering conditions:
Dip Soldering
Pre-Heat
120 °C Max.
Pre-Heat Time
60 Seconds Max.
Solder Bath Temperature 260 °C Max.
Dipping Time
5 Seconds Max.
No lower than 3 mm from
Dipping Position
the base of the epoxy bulb
Hand Soldering
Temperature
350 °C Max.
Soldering Time 3 Seconds Max.
Position
Not closer than 3 mm from
the base of the epoxy bulb
•
•
•
•
•
•
•
•
•
Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Dip soldering and hand soldering should not be done more than one time.
Do not apply any stress to the lead particularly when heated.
The LEDs must not be repositioned after soldering.
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be
caused from warping of the PC board or from the clinching and cutting of the lead frames.
When it is absolutely necessary, the LEDs may be mounted in this fashion but the customer
will assume responsibility for any problems. Direct soldering should only be done adter
testing has confirmed that no damage, such as wire bond failure or resin deterioration, will
occur. Those LEDs should not be soldered directly to double sided PC boards because the
heat will deteriorate the epoxy resin.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
UVLED370-110E
5 of 6
23.08.2011
FPGA/CPLD
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