DLPA004
DATA BUS TRANSIENT SUPPRESSOR
Please click here to visit our online spice models database.
Features
•
•
•
•
•
Fast Switching Speed
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 3)
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
•
Case: SOT-363
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 3)
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish
⎯
Matte Tin annealed over Alloy 42
Leadframe. Solderable per MIL-STD-202, Method 208
Ordering Information: See Page 3
Marking Information: See Page 3
Weight: 0.006 grams (approximate)
N/C
I/O
5
Data Line Transient Protection
NEW PRODUCT
In accordance with (Note 1):
•
IEC 61000-4-2 Contact Method: ±15kV
•
IEC 61000-4-2 Air Discharge Method: ±25kV
N/C
4
SOT-363
6
1
2
3
TOP VIEW
V
P
I/O
Device Schematic
V
N
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
FM(surge)
I
F(AV)
I
FRM
I
FSM
Value
85
60
200
3.5
1
450
4.0
1.0
0.5
Unit
V
V
mA
A
A
mA
A
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Current (Single Diode)
Peak Forward Surge Current
8.3ms Single half Sine-Wave Superimposed on Rated Load
Average Rectified Forward Current (Note 1)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range
Notes:
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
1. Tested with V
CC
pins connected to GND pin.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
DLPA004
Document number: DS31593 Rev. 4 - 2
1 of 4
www.diodes.com
March 2009
© Diodes Incorporated
DLPA004
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
V
F
Min
85
⎯
⎯
Typ
⎯
⎯
⎯
⎯
⎯
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Max
⎯
0.80
0.90
1.0
1.25
2.5
30
50
⎯
2.0
3.0
3.0
Unit
V
V
Leakage Current (Note 5)
I
R
C
T
C
LL
C
LG
t
rr
NEW PRODUCT
⎯
⎯
μA
pF
pF
pF
μs
Total Capacitance (per element)
Capacitance Between Two Data Lines (DL
1
& DL
2
, DL
1
& DL
3
)
Capacitance Between Data Line and Ground
Reverse Recovery Time
Notes:
5. Short duration pulse test used to minimize self-heating effect.
⎯
⎯
⎯
⎯
2
1.6
2.3
⎯
Test Condition
I
R
= 100μA
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
V
R
= 70V
V
R
= 25V, T
J
= 150°C
V
R
= 70V, T
J
= 150°C
V
R
= 0, f = 1.0MHz
V
R
= 0, f = 1.0MHz
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100Ω
P
D
, POWER DISSIPATION (mW)
250
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
300
1,000
100
200
10
150
1.0
100
50
0.1
0
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve, Total Package
0.01
0
1
2
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
10
1
0.1
0
50
100
150
200
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 3 Typical Reverse Characteristics, Per Element
DLPA004
Document number: DS31593 Rev. 4 - 2
2 of 4
www.diodes.com
March 2009
© Diodes Incorporated
DLPA004
Ordering Information
Part Number
DLPA004-7
Notes:
(Note 6)
Case
SOT-363
Packaging
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
JAE = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
NEW PRODUCT
JAE
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
Feb
2
2009
W
Mar
3
2010
X
Apr
4
May
5
YM
2011
Y
Jun
6
2012
Z
Jul
7
Aug
8
2013
A
Sep
9
2014
B
Oct
O
Nov
N
2015
C
Dec
D
Package Outline Dimensions
A
B C
H
K
M
J
D
F
L
SOT-363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
C2
C2
Z
G
C1
Y
X
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
DLPA004
Document number: DS31593 Rev. 4 - 2
3 of 4
www.diodes.com
March 2009
© Diodes Incorporated
DLPA004
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDING TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
NEW PRODUCT
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
DLPA004
Document number: DS31593 Rev. 4 - 2
4 of 4
www.diodes.com
March 2009
© Diodes Incorporated
京公网安备 11010802033920号
EEWORLD
