B3B-443-B525
TECHNICAL DATA
LED, 3 mm
B3B-443-B525 is a InGaN LED mounted on a lead frame with a clear epoxy lens.
On forward bias it emits a band of orange light with a peak at 528 nm.
lnGaN
Specifications
•
•
•
•
Structure: InGaN
Peak Wavelength: typ. 528 nm
Optical Output Power: typ. 5.5 cd
Package: 3 mm clear epoxy
Absolute Maximum Ratings (T
a
=25°C)
Item
Symbol
Value
Power Dissipation
P
D
120
Forward Current
I
F
30
1
Pulse Forward Current *
I
FP
100
Reverse Voltage
V
R
5
Operating Temperature
T
opr
-40 … +85
Storage Temperature
T
stg
-40 … +100
Soldering Temperature *²
T
sol
260
1
*
1/10 duty cycle @ 1 KHz
*²
1.6mm from body, must be completed within 3 seconds
Unit
mW
mA
mA
V
°C
°C
°C
(Unit: mm)
Electro-Optical Characteristics
Item
Forward Voltage
Reverse Current
Luminous Intensity
Peak Wavelength
Dominant Wavelength
Half Width
Viewing Angle *
* Tolerance: -10 / +5 deg.
Symbol
V
F
I
R
I
V
λ
P
λ
D
Δλ
2Θ
1/2
Condition
I
F
= 20 mA
V
R
= 5 V
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
Min.
-
-
3.8
-
-
-
-
Typ.
3.2
-
5.5
528
525
30
20
Max.
3.8
10
-
-
-
-
-
Unit
V
µA
cd
nm
nm
nm
deg.
Notes
•
Do not view directly into the emitting area of the LED during operation!
•
The above specifications are for reference purpose only and subjected to change without prior notice.
10.08.2011
B3B-443-20
1 of 4
Typical Performance Curves
Forward Current – Forward Voltage
Luminous Intensity –Forward Current
Luminous Intensity – Ambient Temperature
Max. Forward Current – Ambient Temperature
Peak Wavelength
Radiation Diagram
10.08.2011
B3B-443-20
2 of 4
Precaution for Use
1. Cautions
•
DO NOT look directly into the emitted light or look through the optical system. To prevent in
adequate exposure of the radiation, wear protective glasses.
2. Lead Forming
•
When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
•
Lead forming should be done before soldering.
•
DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
•
When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
Recommended Land Layout (Unit: mm)
3. Soldering Conditions
•
Solder the LEDs no closer than 3 mm from the base of the lead.
•
DO NOT apply any stress to the lead particularly when heat.
•
The LEDs must not be reposition after soldering.
•
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
•
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
•
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
10.08.2011
B3B-443-20
3 of 4
Soldering Conditions
4. Static Electricity
•
The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
10.08.2011
B3B-443-20
4 of 4
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
