CF
P1
5
PMEG060V050EPD
22 January 2015
60 V, 5 A low VF MEGA Schottky barrier rectifier
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a CFP15 (SOT1289) power
and flat lead Surface-Mounted Device (SMD) plastic package.
2. Features and benefits
•
•
•
•
•
•
Average forward current: I
F(AV)
≤ 5 A
Reverse voltage: V
R
≤ 60 V
Low forward voltage
High power capability due to clip-bonding technology and heat sink
Small and thin SMD power plastic package, typical height 0.78 mm
AEC-Q101 qualified
3. Applications
•
•
•
•
•
•
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Freewheeling application
Reverse polarity protection
Low power consumption application
4. Quick reference data
Table 1.
Symbol
I
F(AV)
V
R
V
F
I
R
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
reverse current
Conditions
δ = 0.5; f = 20 kHz; T
sp
≤ 165 °C;
square wave
T
j
= 25 °C
I
F
= 5 A; t
p
≤ 300 µs; δ ≤ 0.02;
T
j
= 25 °C; pulsed
V
R
= 10 V; t
p
≤ 3 ms; δ ≤ 0.3;
T
j
= 25 °C; pulsed
V
R
= 60 V; t
p
≤ 3 ms; δ ≤ 0.3;
T
j
= 25 °C; pulsed
-
100
400
µA
-
10
30
µA
-
-
-
480
60
560
V
mV
Min
-
Typ
-
Max
5
Unit
A
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NXP Semiconductors
PMEG060V050EPD
60 V, 5 A low VF MEGA Schottky barrier rectifier
5. Pinning information
Table 2.
Pin
1
2
3
Pinning information
Symbol Description
A
A
K
anode
anode
cathode
Simplified outline
1
3
2
Graphic symbol
K
A
A
aaa-009063
CFP15 (SOT1289)
6. Ordering information
Table 3.
Ordering information
Package
Name
PMEG060V050EPD
CFP15
Description
plastic, thermal enhanced ultra thin SMD package; 3 leads;
body: 5.8 x 4.3 x 0.78 mm
Version
SOT1289
Type number
7. Marking
Table 4.
Marking codes
Marking code
060V 050E
Type number
PMEG060V050EPD
PMEG060V050EPD
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
22 January 2015
2 / 15
NXP Semiconductors
PMEG060V050EPD
60 V, 5 A low VF MEGA Schottky barrier rectifier
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
R
I
F
I
F(AV)
I
FSM
P
tot
Parameter
reverse voltage
forward current
average forward current
non-repetitive peak forward
current
total power dissipation
Conditions
T
j
= 25 °C
T
sp
= 160 °C; δ = 1
δ = 0.5; f = 20 kHz; T
sp
≤ 165 °C;
square wave
t
p
= 8 ms; T
j(init)
= 25 °C; square wave
T
amb
≤ 25 °C
[1]
[2]
[3]
Min
-
-
-
-
-
-
-
-
-55
-65
Max
60
7
5
160
1.66
2.15
3.75
175
175
175
Unit
V
A
A
A
W
W
W
°C
°C
°C
T
j
T
amb
T
stg
junction temperature
ambient temperature
storage temperature
[1]
[2]
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
Device mounted on a ceramic Printed-Circuit Board (PCB), Al
2
O
3
, standard footprint.
2
PMEG060V050EPD
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
22 January 2015
3 / 15
NXP Semiconductors
PMEG060V050EPD
60 V, 5 A low VF MEGA Schottky barrier rectifier
9. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
thermal resistance
from junction to solder
point
[1]
[2]
[3]
[4]
[5]
10
2
Z
th(j-a)
(K/W)
10
Conditions
in free air
[1][2]
[1][3]
[1][4]
[5]
Min
-
-
-
-
Typ
-
-
-
-
Max
90
70
40
3
Unit
K/W
K/W
K/W
K/W
R
th(j-sp)
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses P
R
are a significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Soldering point of cathode tab.
aaa-015000
2
duty cycle = 1
0.75
0.33
0.2
0.5
0.25
0.1
0.05
0.02
1
0.01
10
-1
10
-3
0
10
-2
10
-1
1
10
10
2
t
p
(s)
10
3
FR4 PCB, standard footprint
Fig. 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG060V050EPD
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
22 January 2015
4 / 15
NXP Semiconductors
PMEG060V050EPD
60 V, 5 A low VF MEGA Schottky barrier rectifier
10
2
Z
th(j-a)
(K/W)
10
aaa-015001
duty cycle = 1
0.75
0.33
0.2
0.5
0.25
0.1
0.05
1
0.01
0.02
10
-1
10
-3
0
10
-2
10
-1
2
1
10
10
2
t
p
(s)
10
3
FR4 PCB, mounting pad for cathode 1 cm
Fig. 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
10
2
aaa-015002
Z
th(j-a)
(K/W)
10
duty cycle = 1
0.75
0.33
0.2
0.5
0.25
0.1
0.05
1
0.01
0.02
10
-1
10
-3
0
10
-2
10
-1
1
10
10
2
t
p
(s)
10
3
Ceramic PCB, Al
2
O
3
, standard footprint
Fig. 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG060V050EPD
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
22 January 2015
5 / 15
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