BAS70LP
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
•
•
•
•
Low Turn-on Voltage
Fast Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Mechanical Data
•
•
•
•
•
Case: DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - NiPdAu annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
NEW PRODUCT
DFN1006-2
Top View
Bottom View
Ordering Information
(Note 3)
Part Number
BAS70LP-7B
Notes:
Case
DFN1006-2
Packaging
10,000/Tape & Reel
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
73 = Product Type Marking Code
Bar Denotes Cathode Side
BAS70LP
Document number: DS35105 Rev. 2 - 2
1 of 4
www.diodes.com
March 2011
© Diodes Incorporated
BAS70LP
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 4)
Non-Repetitive Peak Forward Surge Current @ t
p
<
1.0s
Symbol
V
RRM
Value
70
70
800
Unit
V
mA
mA
V
RWM
V
R
I
FM
I
FSM
NEW PRODUCT
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
430
295
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes:
Symbol
V
(BR)R
V
F
I
R
C
T
t
rr
Min
70
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
1
1.6
Max
-
0.42
0.75
0.96
0.1
10
-
-
Unit
V
V
μA
pF
ns
Test Condition
I
R
= 10μA
I
F
= 1.0mA, T
J
= 25*C
I
F
= 10mA, T
J
= 25*C
I
F
= 15mA, T
J
= 25*C
V
R
= 50V, T
J
= 25*C
V
R
= 70V, T
J
= 25*C
V
R
= 0V, f = 1.0MHz
I
F
= I
R
= 10mA to IR = 1.0mA,
I
rr
= 0.1 x I
R
, R
L
= 100Ω
4. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
P
D
, POWER DISSIPATION (W)
0.4
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
0.5
100
10
T
A
= 150°C
0.3
T
A
= 125°C
1
T
A
= 85°C
T
A
= 25°C
0.2
0.1
0.1
0
0
0.1
0.2
0.3
0.4
0.5
0.01
0
0.5
1.0
1.5
2.0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Fig. 1 Forward Power Dissipation
BAS70LP
Document number: DS35105 Rev. 2 - 2
2 of 4
www.diodes.com
March 2011
© Diodes Incorporated
BAS70LP
I
R
, INSTANTANEOUS REVERSE CURRENT(µA)
100
T
A
= 150°C
10
f = 1MHz
10
T
A
= 125°C
1
T
A
= 85°C
C, CAPACITANCE (pF)
0.1
1
NEW PRODUCT
0.01
T
A
= 25°C
0.001
0.0001
0
0
10
20
30
40
50
60
70
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
0
8
16
24
32
V
R
, DC REVERSE VOLTAGE (V)
40
80
I
F(AV)
, AVERAGE FORWARD CURRENT (mA)
70
60
50
40
30
20
10
0
25
Note 4
150
T
A
, DERATED AMBIENT TEMPERATURE (°C)
125
100
75
50
25
0
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 5 Forward Current Derating Curve
175
0
7
14 21 28 35 42 49 56 63 70
V
R
, DC REVERSE VOLTAGE (V)
Fig. 6 Operating Temperature Derating
Package Outline Dimensions
A
A1
D
R
E
b
DFN1006-2
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0
0.05
0.03
b
0.45
0.55
0.50
D
0.95
1.075
1.00
E
0.55
0.675
0.60
e
-
-
0.40
L
0.20
0.30
0.25
R
0.05
0.15
0.10
All Dimensions in mm
L
e
BAS70LP
Document number: DS35105 Rev. 2 - 2
3 of 4
www.diodes.com
March 2011
© Diodes Incorporated
BAS70LP
Suggested Pad Layout
C
NEW PRODUCT
X
Y
G
Z
Dimensions
Z
G
X
Y
C
Value (in mm)
1.1
0.3
0.7
0.4
0.7
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
BAS70LP
Document number: DS35105 Rev. 2 - 2
4 of 4
www.diodes.com
March 2011
© Diodes Incorporated
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