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ISL6430CB

Description
SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PDSO14, PLASTIC, MS-012AB, SOIC-14
CategoryPower/power management    The power supply circuit   
File Size393KB,12 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

ISL6430CB Overview

SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PDSO14, PLASTIC, MS-012AB, SOIC-14

ISL6430CB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instructionSOP, SOP14,.25
Contacts14
Reach Compliance Codenot_compliant
ECCN codeEAR99
Analog Integrated Circuits - Other TypesSWITCHING CONTROLLER
control modeVOLTAGE-MODE
Control TechnologyPULSE WIDTH MODULATION
Maximum input voltage13.2 V
Minimum input voltage10.8 V
Nominal input voltage12 V
JESD-30 codeR-PDSO-G14
JESD-609 codee0
length8.65 mm
Number of functions1
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.75 mm
surface mountYES
Switch configurationPUSH-PULL
Maximum switching frequency1000 kHz
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm

ISL6430CB Preview

®
ISL6430
Data Sheet
July 2003
FN9017.2
Single Sync Buck PWM Controller for
Broadband Gateway Applications
The ISL6430 provides complete control and protection for a
DC-DC converter optimized for high-performance broadband
gateway applications. It is designed to drive two N Channel
MOSFETs in a synchronous-rectified buck topology. The
ISL6430 integrates all of the control, output adjustment,
monitoring and protection functions into a single package.
The output voltage of the converter can be precisely
regulated to as low as 1.27V, with a maximum tolerance of
±1%
over temperature and line voltage variations.
The ISL6430 provides simple, single feedback loop, voltage-
mode control with fast transient response. It includes a
200kHz free-running triangle-wave oscillator that is
adjustable from below 50kHz to over 1MHz. The error
amplifier features a 15MHz gain-bandwidth product and
6V/µs slew rate which enables high converter bandwidth for
fast transient performance. The resulting PWM duty ratio
ranges from 0% to 100%.
The ISL6430 protects against over-current conditions by
inhibiting PWM operation. The ISL6430 monitors the current
by using the r
DS(ON)
of the upper MOSFET which eliminates
the need for a current sensing resistor.
Features
• Drives Two N-Channel MOSFETs
• Operates From +5V or +12V Input
• Simple Single-Loop Control Design
- Voltage-Mode PWM Control
• Fast Transient Response
- High-Bandwidth Error Amplifier
- Full 0% to 100% Duty Ratio
• Excellent Output Voltage Regulation
- 1.27V Internal Reference
-
±1%
Over Line Voltage and Temperature
• Over-Current Fault Monitor
- Does Not Require Extra Current Sensing Element
- Uses MOSFETs r
DS(ON)
• Small Converter Size
- Constant Frequency Operation
- 200kHz Free-Running Oscillator Programmable from
50kHz to Over 1MHz
• 14-Lead SOIC and 16-Lead QFN
Applications
• Cable Modems, Set-Top Boxes and DSL Modems
• DSP and Core Communications Processor Supplies
Ordering Information
TEMP.
PART NUMBER RANGE (
o
C)
ISL6430CB
ISL6430CR
0 to 70
0 to 70
PACKAGE
14 Ld SOIC
16 Ld QFN
PKG. DWG. #
M14.15
L16.5x5B
• High-Power 5V Input DC-DC Regulators
• Low-Voltage Distributed Power Supplies
Add -T suffix to either option for tape and reel packaging.
Pinout
ISL6430 (SOIC)
TOP VIEW
RT
OCSET
SS
COMP
FB
EN
GND
1
2
3
4
5
6
7
14 VCC
SS
13 PVCC
12 LGATE
11 PGND
10 BOOT
9
8
UGATE
PHASE
NC
COMP
FP
EN
1
2
3
4
5
NC
6
GND
7
PHASE
8
UGATE
12
11
10
9
PVCC
LGATE
PGND
BOOT
ISL6430 (QFN)
TOP VIEW
OCSET
VCC
13
16
15
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
RT
14
ISL6430
Typical Application
12V
VCC
OCSET
MONITOR AND
PROTECTION
EN
BOOT
RT
+5V OR +12V
SS
OSC
ISL6430
REF
-
+
UGATE
PHASE
+V
O
PVCC
LGATE
PGND
GND
+12V
FB
+
-
COMP
Block Diagram
VCC
POWER-ON
RESET (POR)
10µA
OCSET
+
-
OVER-
CURRENT
4V
SOFT-
START
EN
SS
BOOT
UGATE
PHASE
200µA
1.27 VREF
REFERENCE
+
-
ERROR
AMP
PWM
COMPARATOR
+
-
INHIBIT
PWM
GATE
CONTROL
LOGIC
PVCC
LGATE
PGND
FB
COMP
GND
RT
OSCILLATOR
2
ISL6430
Absolute Maximum Ratings
Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15.0V
Boot Voltage, V
BOOT
- V
PHASE
. . . . . . . . . . . . . . . . . . . . . . +15.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.3V to V
CC
+0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Thermal Information
Thermal Resistance
θ
JA
(
o
C/W)
θ
JC
(
o
C/W)
SOIC Package (Note 1) . . . . . . . . . . . .
67
N/A
QFN Package (Note 2). . . . . . . . . . . . .
35
5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
(SOIC Lead tips only)
For Recommended soldering conditions see Tech Brief TB389.
Operating Conditions
Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . +12V
±10%
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
Junction Temperature Range . . . . . . . . . . . . . . . . . . . 0
o
C to 125
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
θ
JC,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
PARAMETER
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
POWER-ON RESET
Rising V
CC
Threshold
Falling V
CC
Threshold
Enable - Input threshold Voltage
Rising V
OCSET
Threshold
OSCILLATOR
Free Running Frequency
Total Variation
Ramp Amplitude
REFERENCE
Reference Voltage
ERROR AMPLIFIER
DC Gain
Gain-Bandwidth Product
Slew Rate
GATE DRIVERS
Upper Gate Source
Upper Gate Sink
Lower Gate Source
Lower Gate Sink
PROTECTION
OCSET Current Source
Soft Start Current
Recommended operating conditions, unless otherwise noted.
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
I
CC
EN = V
CC
; UGATE and LGATE Open
EN = 0V
-
-
5
50
-
100
mA
µA
V
OCSET
= 4.5VDC
V
OCSET
= 4.5VDC
V
OCSET
= 4.5VDC
-
8.2
0.8
-
-
-
-
1.27
10.4
-
2.0
-
V
V
V
V
R
T
= OPEN, V
CC
= 12
6kΩ < R
T
to GND < 200kΩ
∆V
OSC
R
T
= OPEN
185
-15
-
200
-
1.9
215
+15
-
kHz
%
V
P-P
1.258
1.270
1.282
V
-
GBW
SR
COMP = 10pF
-
-
88
15
6
-
-
-
dB
MHz
V/µs
I
UGATE
R
UGATE
I
LGATE
R
LGATE
V
BOOT
- V
PHASE
= 12V, V
UGATE
= 6V
I
LGATE
= 0.3A
V
CC
= 12V, V
LGATE
= 6V
I
LGATE
= 0.3A
350
-
300
-
500
5.5
450
3.5
-
10
-
6.5
mA
mA
I
OCSET
I
SS
V
OCSET
= 4.5VDC
170
-
200
10
230
-
µA
µA
3
ISL6430
Typical Performance Curves
80
70
1000
RESISTANCE (kΩ)
R
T
PULLUP
TO +12V
I
VCC
(mA)
60
C
GATE
= 3300pF
50
40
30
20
10
0
100
200
C
GATE
= 10pF
300 400 500 600 700 800
SWITCHING FREQUENCY (kHz)
900
1000
C
GATE
= 1000pF
100
R
T
PULLDOWN
TO V
SS
10
10
100
SWITCHING FREQUENCY (kHz)
1000
FIGURE 1. R
T
RESISTANCE vs FREQUENCY
FIGURE 2. BIAS SUPPLY CURRENT vs FREQUENCY
Functional Pin Description
RT
This pin provides oscillator switching frequency adjustment.
By placing a resistor (R
T
) from this pin to GND, the nominal
200kHz switching frequency is increased according to the
following equation:
5
10
-
Fs
200kHz
+ --------------------
R
T
(
kΩ
)
6
EN
This pin is the open-collector enable pin. Pull this pin below
1V to disable the converter. In shutdown, the soft start pin is
discharged and the UGATE and LGATE pins are held low.
GND
Signal ground for the IC. All voltage levels are measured
with respect to this pin.
(R
T
to GND)
PHASE
Connect the PHASE pin to the upper MOSFET source. This
pin is used to monitor the voltage drop across the MOSFET
for over-current protection. This pin also provides the return
path for the upper gate drive.
Conversely, connecting a pull-up resistor (R
T
) from this pin
to V
CC
reduces the switching frequency according to the
following equation.:
4
10
Fs
200kHz
– --------------------
-
R
T
(
kΩ
)
7
(R
T
to 12V)
UGATE
Connect UGATE to the upper MOSFET gate. This pin
provides the gate drive for the upper MOSFET.
OCSET
Connect a resistor (R
OCSET
) from this pin to the drain of the
upper MOSFET. R
OCSET
, an internal 200µA current source
(I
OCS
), and the upper MOSFET on-resistance (r
DS(ON)
) set
the converter over-current (OC) trip point according to the
following equation:
I
OCS
R
OCSET
I
PEAK
= -------------------------------------------
-
r
DS
(
ON
)
BOOT
This pin provides bias voltage to the upper MOSFET driver.
A bootstrap circuit may be used to create a BOOT voltage
suitable to drive a standard N-Channel MOSFET.
PGND
This is the power ground connection. Tie the lower MOSFET
source to this pin.
An over-current trip cycles the soft-start function.
LGATE
Connect LGATE to the lower MOSFET gate. This pin
provides the gate drive for the lower MOSFET.
SS
Connect a capacitor from this pin to ground. This capacitor,
along with an internal 10µA current source, sets the soft-
start interval of the converter.
PVCC
Provide a bias supply for the lower gate drive to this pin.
COMP and FB
COMP and FB are the available external pins of the error
amplifier. The FB pin is the inverting input of the error
amplifier and the COMP pin is the error amplifier output.
These pins are used to compensate the voltage-control
feedback loop of the converter.
4
VCC
Provide a 12V bias supply for the chip to this pin.
ISL6430
Functional Description
Initialization
The ISL6430 automatically initializes upon receipt of power.
Special sequencing of the input supplies is not necessary.
The Power-On Reset (POR) function continually monitors
the input supply voltages and the enable (EN) pin. The POR
monitors the bias voltage at the VCC pin and the input
voltage (V
IN
) on the OCSET pin. The level on OCSET is
equal to V
IN
Less a fixed voltage drop (see over-current
protection). With the EN pin held to V
CC
, the POR function
initiates soft start operation after both input supply voltages
exceed their POR thresholds. For operation with a single
+12V power source, V
IN
and V
CC
are equivalent and the
+12V power source must exceed the rising V
CC
threshold
before POR initiates operation.
The Power-On Reset (POR) function inhibits operation with
the chip disabled (EN pin low). With both input supplies
above their POR thresholds, transitioning the EN pin high
initiates a soft start interval.
voltage and the output voltage is in regulation. This method
provides a rapid and controlled output voltage rise.
SOFT-START
OUTPUT INDUCTOR
4V
2V
0V
15A
10A
5A
0A
TIME (20ms/DIV)
FIGURE 4. OVER-CURRENT OPERATION
Soft Start
The POR function initiates the soft start sequence. An internal
10µA current source charges an external capacitor (C
SS
) on
the SS pin to 4V. Soft start clamps the error amplifier output
(COMP pin) and reference input (+ terminal of error amp) to
the SS pin voltage. Figure 3 shows the soft start interval with
C
SS
= 0.1µF.
Over-Current Protection
The over-current function protects the converter from a
shorted output by using the upper MOSFETs on-resistance,
r
DS(ON)
to monitor the current. This method enhances the
converter’s efficiency and reduces cost by eliminating a
current sensing resistor.
The over-current function cycles the soft-start function in a
hiccup mode to provide fault protection. A resistor (R
OCSET
)
programs the over-current trip level. An internal 200µA
(typical) current sink develops a voltage across R
OCSET
that
is reference to V
IN
. When the voltage across the upper
MOSFET (also referenced to V
IN
) exceeds the voltage
across R
OCSET
, the over-current function initiates a soft-
start sequence. The soft-start function discharges C
SS
with
a 10µA current sink and inhibits PWM operation. The soft-
start function recharges C
SS
, and PWM operation resumes
with the error amplifier clamped to the SS voltage. Should an
overload occur while recharging C
SS
, the soft start function
inhibits PWM operation while fully charging C
SS
to 4V to
complete its cycle. Figure 4 shows this operation with an
overload condition. Note that the inductor current increases
to over 15A during the C
SS
charging interval and causes an
over-current trip. The converter dissipates very little power
with this method. The measured input power for the
conditions of Figure 4 is 2.5W.
The over-current function will trip at a peak inductor current
(I
PEAK)
determined by:
I
OCSET
R
OCSET
I
PEAK
= --------------------------------------------------
-
r
DS
(
ON
)
SOFT-START
(1V/DIV)
0V
0V
t1
t2
OUTPUT
VOLTAGE
(1V/DIV)
t3
TIME (5ms/DIV)
FIGURE 3. SOFT-START INTERVAL
Initially the clamp on the error amplifier (COMP pin) controls
the converter’s output voltage. At t1 in Figure 3, the SS
voltage reaches the valley of the oscillator’s triangle wave.
The oscillator’s triangular waveform is compared to the
ramping error amplifier voltage. This generates PHASE
pulses of increasing width that charge the output capacitor(s).
This interval of increasing pulse width continues to t2. With
sufficient output voltage, the clamp on the reference input
controls the output voltage. This is the interval between t2 and
t3 in Figure 3. At t3 the SS voltage exceeds the reference
5
where I
OCSET
is the internal OCSET current source (200µA
- typical). The OC trip point varies mainly due to the
MOSFETs r
DS(ON)
variations. To avoid over-current tripping
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