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ECCM1H-25-25.000M

Description
QUARTZ CRYSTAL RESONATOR, 25 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size122KB,4 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance
Download Datasheet Parametric View All

ECCM1H-25-25.000M Overview

QUARTZ CRYSTAL RESONATOR, 25 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM1H-25-25.000M Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codeunknown
Other featuresAT-CUT CRYSTAL; BULK
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level50 µW
frequency stability0.003%
frequency tolerance15 ppm
JESD-609 codee4
load capacitance25 pF
Manufacturer's serial numberECCM1
Installation featuresSURFACE MOUNT
Nominal operating frequency25 MHz
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
physical sizeL7.0XB5.0XH1.3 (mm)/L0.276XB0.197XH0.051 (inch)
Series resistance30 Ω
surface mountYES
Terminal surfaceGold (Au) - with Nickel (Ni) barrier

ECCM1H-25-25.000M Preview

ECCM1H-25-25.000M
ECCM1 H
Series
RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic
SMD Crystal
Frequency Tolerance/Stability
±15ppm at 25°C, ±30ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
-25 -25.000M
Nominal Frequency
25.000MHz
Load Capacitance
25pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
25.000MHz
±15ppm at 25°C, ±30ppm over -40°C to +85°C
±3ppm/year Maximum
25pF Parallel Resonant
7pF Maximum
30 Ohms Maximum
AT-Cut Fundamental
50µWatts Maximum, 50µWatts Correlation
-3dB Minimum (Measured from Fo to Fo +5000ppm)
-40°C to +85°C
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
5.00
±0.15
1
7.00
±0.15
2
4
MARKING
ORIENTATION
2.54 ±0.20
1.2 ±0.1
(x4)
4
1
4.6
±0.2
3
1.3 MAX
3
2
1
2
3
4
LINE MARKING
1
2
E25.00
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1.0 ±0.2
(x4)
Note: Chamfer and index
mark not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 1 of 4
ECCM1H-25-25.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.4 (x4)
2.2 (X4)
3.6
Solder Land
(X4)
1.1
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 2 of 4
ECCM1H-25-25.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 3 of 4
ECCM1H-25-25.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 4 of 4
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