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AM28F256A-200PEB

Description
256 Kilobit (32 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms
Categorystorage    storage   
File Size225KB,35 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM28F256A-200PEB Overview

256 Kilobit (32 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms

AM28F256A-200PEB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionPLASTIC, DIP-32
Contacts32
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time200 ns
Other features100K WRITE/ERASE CYCLES MIN
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length42.164 mm
memory density262144 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height5.715 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
FINAL
Am28F256A
256 Kilobit (32 K x 8-Bit)
CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms
DISTINCTIVE CHARACTERISTICS
s
High performance
— Access times as fast as 70 ns
s
CMOS low power consumption
— 30 mA maximum active current
— 100 µA maximum standby current
— No data retention power consumption
s
Compatible with JEDEC-standard byte-wide
32-Pin EPROM pinouts
— 32-pin PDIP
— 32-pin PLCC
— 32-pin TSOP
s
100,000 write/erase cycles minimum
s
Write and erase voltage 12.0 V
±5%
s
Latch-up protected to 100 mA from –1 V to
V
CC
+1 V
s
Embedded Erase Electrical Bulk Chip-Erase
— 1.5 seconds typical chip-erase including
pre-programming
s
Embedded Program
— 14 µs typical byte-program including time-out
— 0.5 second typical chip program
s
Command register architecture for
microprocessor/microcontroller compatible
write interface
s
On-chip address and data latches
s
Advanced CMOS flash memory technology
— Low cost single transistor memory cell
s
Embedded algorithms for completely
self-timed write/erase operations
GENERAL DESCRIPTION
The Am28F256A is a 256 K Flash memory organized
as 32 Kbytes of 8 bits each. AMD’s Flash memories
offer the most cost-effective and reliable read/write
non- volatile random access memory. The Am28F256A
is packaged in 32-pin PDIP, PLCC, and TSOP versions.
It is designed to be reprogrammed and erased in-sys-
tem or in standard EPROM programmers. The
Am28F256A is erased when shipped from the factory.
The standard Am28F256A offers access times as fast
as 70 ns, allowing operation of high-speed micropro-
cessors without wait states. To eliminate bus conten-
tion, the Am28F256A has separate chip enable (CE#)
and output enable (OE#) controls.
AMD’s Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
Am28F256A uses a command register to manage this
functionality, while maintaining a standard JEDEC
Flash Standard 32-pin pinout. The command register
allows for 100% TTL level control inputs and fixed
power supply levels during erase and programming.
AMD’s Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles.
The AMD cell is designed to optimize the erase and
Publication#
18879
Rev:
C
Amendment/+2
Issue Date:
May 1998
programming mechanisms. In addition, the combina-
tion of advanced tunnel oxide processing and low inter-
nal electr ic fields for erase a nd programmi ng
operations produces reliable cycling. The Am28F256A
uses a 12.0V± 5% V
PP
high voltage input to perform
the erase and programming functions.
The highest degree of latch-up protection is achieved
with AMD’s proprietary non-epi process. Latch-up pro-
tection is provided for stresses up to 100 milliamps on
address and data pins from –1 V to V
CC
+1 V.
Embedded Program
The Am28F256A is byte programmable using the
Embedded Programming algorithm. The Embedded
Programming algorithm does not require the system to
time-out or verify the data programmed. The typical
room temperature programming time of the
Am28F256A is one half second.
Embedded Erase
The entire chip is bulk erased using the Embedded
Erase algorithm. The Embedded Erase algorithm
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are

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