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MADP-064908-131000_15

Description
Surmount PIN Chip
File Size148KB,7 Pages
ManufacturerMACOM
Websitehttp://www.macom.com
Download Datasheet View All

MADP-064908-131000_15 Overview

Surmount PIN Chip

MADP-064908-131000
Unconnected Double Tee
Surmount
TM
PIN Chip
RoHS Compliant
Features
No Wire Bonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Ultra-Low Parasitic Capacitance and Inductance
Higher RF C.W. Power Handling
Better Performance than Packaged Devices
Rev. V3
Case Style - ODS-1310
Description and Applications
This device is a silicon glass PIN diode chip fabricated with
M/A-COM Tech Solutions patented HMIC process.
This 80μm I-region length device features six silicon
pedestals embedded in a low loss, low dispersion
glass. The diodes are formed on the top of a ped-
estal and connections to the backside of the device
are facilitated by making the pedestal sidewalls elec-
trically conductive. Selective backside metallization is ap-
plied producing a surface mount device. The topside
is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch protection.
These protective coatings prevent damage to the
junction and the anode air-bridge during handling
and assembly. The vertical silicon diode topology
provides for a highly efficient heat transfer medium.
These surface mount devices are suitable for usage
in higher (3W avg.) incident power switches. Small
parasitic inductance and excellent RC constant
make these devices ideal for absorptive SPST, re-
flective SP2T switches, and attenuator circuits,
where higher P1db and power handling values are
required.
Absolute Maximum Ratings
1
@ T
AMB
= +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
Absolute Maximum
250mA
–100V
-55°C to +125°C
-55°C to +150°C
+175°C
+35dBm
+300°C for 10 seconds
Dim
Min.
A
B
C
D
Inches
Max.
0.062
0.038
0.008
0.012
0.060
0.036
0.004
0.011
Millimeters
Min.
Max.
1.524
0.914
0.102
0.279
1.575
0.965
0.203
0.305
1. Operation of this device above any one of these parameters may
cause permanent damage.
ADVANCED:
Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY:
Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
India
Tel: +91.80.43537383 •
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.

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