ABSOLUTE MAXIMUM RATINGS
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7
T
C
T
J
-40°C to +85°C
-55°C to +125°C
175°C
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ELECTRICAL SPECIFICATIONS
Parameter
STATIC
Supply Voltge Range
Quiescent Current
INPUT
Input Offset Voltage
Input Bias Current
2
V
CM
=±5V
VCC=24V to 30V
VIN=0V
1
2,3
1
4
1
-
-
-
48
60
±0.5
-
5
54
75
±5
±30
20
-
-
-
-
-
48
60
±0.5
-
5
54
75
±10
-
30
-
-
mV
mV
μA
dB
dB
2
VIN=0V
-
1
2,3
±12
-
-
±15
±28
-
±16
±30
±50
±12
-
-
±15
±28
-
±16
±35
-
V
mA
mA
Test Conditions
1
Group A
Subgroup
Min.
MSK111H
Typ.
Max.
Min.
MSK111
Typ.
Max.
Units
Common Mode Rejection 2
Power Supply Rejection 2
OUTPUT
Output Voltage Swing
Output Current
Power Bandwidth 2
Settling Time 2
Slew Rate
Propagation Delay 2
Thermal Resistance 2
Internal Feedback Resistor
f=1KHz R
L
=1KΩ
f=1KHz R
L
=50Ω
V
O
=20V
PP
10V Step
V
OUT
=±10V R
L
=1KΩ
T
C
=25°C
Junction to Case @ 125°C
Rf
4
4
-
-
4
-
-
-
±10
400
-
-
2500
-
-
1.497
±11
-
40
20
3000
2.9
31
1.5
-
-
-
-
-
-
-
±10
400
-
-
±11
-
40
20
-
-
-
-
-
-
-
1.505
2500 3000
-
-
2.9
35
1.5
1.503 1.495
NOTES:
1 Unless otherwise specified, ±VCC=±15V A
V
=10V/V and R
L
=∞ and Tc=25°C.
2 Guaranteed by design but not tested. Typical parameters are representative of actual device
performance but are for reference only.
3 Industrial grade devices shall be tested to subgroups 1 and 4 unless otherwise specified.
4 Military grade devices ("H" suffix) shall be 100% tested to subgroups 1,2,3 and 4.
5 Subgroup 5 and 6 testing available upon request.
6 Subgroup 1,4 T
A
=T
C
=+25°C
Subgroup 2,5 T
A
=T
C
=+125°C
Subgroup 3,6 T
A
=T
C
=-55°C
7 Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.
8 Internal solder reflow temperature is 180°C, do not exceed.
30
2
8548-136 Rev. C 10/14
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VCC
I
OUT
V
IN
V
IN
Total Supply Voltage
Output Current
Differential Input Voltage
Common Mode Input Voltage
32V
0.4A
±6V
±VCC
T
ST
T
LD
Storage Temperature Range
Lead Temperature Range
(10 Seconds)
Case Operating Temperature
MSK111
MSK111H
Junction Temperature
8
-65°C to +150°C
300°C
V
mA
MHz
nS
V/μS
nS
°C/W
KΩ
APPLICATION NOTES
POWER SUPPLY BYPASSING
Both the negative and the positive supplies must be ef-
fectively decoupled with a high and low frequency bypass
circuit to avoid power supply induced oscillation. An ef-
fective decoupling scheme consists of a 0.01 microfarad
ceramic capacitor in parallel with a 4.7 microfarad tanta-
lum capacitor from each power supply pin to ground. All
power supply decoupling capacitors should be placed as
close to the package power supply pins as possible.
Output, power supply, and bypass leads should be kept
as short as possible. Long connections can add signifi-
cant inductance, raising impedance and limiting output
current slew rate. This is especially true in the video fre-
quency range.
The case of the MSK111 is electrically isolated and should
be connected to a common ground plane. In addition to
the case, the input signal and input resistors should be
connected to this common ground plane using a single
point grounding scheme. This will help to prevent undes-
ired current feedback that can cause instability in the cir-
cuit.
HEAT SINKING
To select the correct heat sink for your application, refer
to the thermal model and governing equation below.
Thermal Model:
Governing Equation:
T
J
= P
D
x (R
θ
JC
+ R
θ
CS
+ R
θ
SA
) + T
A
Where
T
J
P
D
R
θJC
R
θCS
R
θSA
T
C
T
A
T
S
=
=
=
=
=
=
=
=
Junction Temperature
Total Power Dissipation
Junction to Case Thermal Resistance
Case to Heat Sink Thermal Resistance
Heat Sink to Ambient Thermal Resistance
Case Temperature
Ambient Temperature
Sink Temperature
GAIN
The MSK111, unlike most operational amplifiers, has an
internal feedback resistor. The value of this resistor is
1.5KΩ. Fewer external components are required to con-
figure the MSK111 in either inverting or non-inverting
modes. Using an internal feedback resistor shortens the
feedback path, lowering summing node capacitance to
ground and stabilizing high frequency characteristics.
IN
OUTPUT OFFSET NULL
Typically,the MSK111 has an input offset voltage of less
than ±2mV. The input offset voltage is laser trimmed to
less than ±5mV, but in applications where offset is criti-
cal, the balance pins may be used to null the offset to
zero. A 20KΩ potentiometer may be placed between pins
4 and 8 with the wiper arm connected to +VCC. If the
balance function is not used pins 4 and 8 should not be
connected (floating). However, if settling time is extremely
important, pin 8 should be tied to the AC ground with a
100-150pF capacitor.
Example:
In our example the amplifier application requires the output
to drive a 10 volt peak sine wave across a 50 ohm load for 0.2
amp of output current. For a worst case analysis we will treat
the 0.2 amp peak output current as a D.C. output current. The
power supplies are ±15 VDC.
1.) Find Power Dissipation
P
D
=[(quiescent current) x (+VCC
-
(VCC))] + [(V
S
-
V
O
) x I
OUT
]
=(28 mA) x (30V) + (5V) x (0.2A)
=0.84W + 1W
=1.84W
2.) For conservative design, set T
J
= +150°C.
3.) For this example, worst case T
A
= +25°C.
4.) R
θJC
= 31°C/W
5.) Rearrange governing equation to solve for R
θSA:
R
θSA
= (T
J
- T
A
) / P
D
- (R
θJC
) - (R
θCS
)
= (150°C - 25°C) / 1.84W - (31°C/W) - (0.15°C/W)
= 36°C/W
The heat sink in this example must have a thermal resistance
of no more than 36°C/W to maintain a junction temperature of
less than +150°C. This calculation assumes a case to sink
thermal resistance of 0.15°C/W.
3
8548-136 Rev. C 10/14
SAFE OPERATING AREA-POWER DISSIPATION
The safe operating area curve is a graphical representa-
tion of the power handling capability of the amplifier under
various conditions. The wire bond current carrying capa-
bility, transistor junction temperature and secondary break-
down limitations are all incorporated into the safe operat-
ing area curves. All applications should be checked against
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